New Equipment | Test Equipment
The Calotest provides quick, simple and inexpensive determination of coating thickness. A sphere of a known diameter is rotated against the coating surface and the addition of an abrasive slurry causes a spherically-shaped depression to be abraded th
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New Equipment | Cable & Wire Harness Equipment
200 standard cables 2Yr Product Support Subscription (PSS): Comprising Warranty, free tech support, free software upgrades, and more. Renewable. Select Options: Hardware 128-point Expansion Module (attaches to base) 4-Wire Kelvin Resistanc
Electronics Forum | Thu May 26 18:19:01 EDT 2005 | darby
You should be able to export this data from each machine into an ascii format. Import into Excel and do what you want with it. I don't see that you should have to pay for any software at all. If you are not familiar with Excel and macros etc then get
Electronics Forum | Fri Aug 02 10:38:02 EDT 2024 | spoiltforchoice
There are several solutions on forums & youtube for breaking up a cell into multiple rows. I have this macro in LibreOffice Calc for expanding ranges if only I knew how to format on this hideous forum software REM ***** BASIC ***
Used SMT Equipment | General Purpose Test & Measurement
We ship worldwide. Please feel free to contact us if you need further information. World Class Optical Performance & Flexibility* High wavelength resolution: 0.02 nm Wide close-in dynamic range Single Mode and Multimode fiber test capability, vi
Used SMT Equipment | In-Circuit Testers
Anritsu MS4630B 10 Hz to 300 MHz The MS4630B is suitable for electronics production lines demanding fast and accurate device measurements. It is particularly well suited to accurate high-speed, evaluation of IF filter resonance and group delay
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2013-03-12 16:31:06.0
IPC – Association Connecting Electronics Industries®, predicts a modest return to growth in the North American PCB market in 2013.
Technical Library | 2019-10-16 23:18:15.0
Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.
Technical Library | 2022-10-11 20:29:31.0
Electronic assemblies deployed in harsh environments may be subjected to multiple thermal environments during the use-life of the equipment. Often the equipment may not have any macro-indicators of damage such as cracks or delamination. Quantiication of thermal environments during use-life is often not feasible because of the data-capture and storage requirements, and the overhead on core-system functionality. There is need for tools and techniques to quantify damage in deployed systems in absence of macro-indicators of damage without knowledge of prior stress history. The presented PHM framework is targeted towards high reliability applications such as avionic and space systems. In this paper, Sn3.0Ag0.5Cu alloy packages have been subjected to multiple thermal cycling environments including -55 to 125C and 0 to 100C. Assemblies investigated include area-array packages soldered on FR4 printed circuit cards. The methodology involves the use of condition monitoring devices, for gathering data on damage pre-cursors at periodic intervals. Damage-state interrogation technique has been developed based on the Levenberg-Marquardt Algorithm in conjunction with the microstructural damage evolution proxies. The presented technique is applicable to electronic assemblies which have been deployed on one thermal environment, then withdrawn from service and targeted for redeployment in a different thermal environment. Test cases have been presented to demonstrate the viability of the technique for assessment of prior damage, operational readiness and residual life for assemblies exposed to multiple thermo-mechanical environments. Prognosticated prior damage and the residual life show good correlation with experimental data, demonstrating the validity of the presented technique for multiple thermo-mechanical environments.
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Functions combined in one bench-top cabinet In-circuit testing functions are assembled into a system or line to save space in the testing facility, enabling easy support of cell production. Macro test Includes the macro test, a high-performance capa
Events Calendar | Tue May 16 00:00:00 EDT 2023 - Tue May 16 00:00:00 EDT 2023 | Milwaukee, Wisconsin USA
"Improving Reliability of Continuity and HiPot Testing" | Training Workshop | A Professional Development Course by CAMI Research
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
’ industry void definition standard [4]. Macro voids have been the focus of the electronics industry for influencing solder joint integrity
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/4000plus-bondtester
Brochure 4000Plus Bondtester The second generation Nordson DAGE 4000 Plus is the most advanced bondtester on the market. Representing the best-in-class, the 4000 Plus bondtester sets the industry standard in bond testing offering unsurpassed accuracy and repeatability of data, providing complete confidence in results
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