Used SMT Equipment | Assembly Accessories
we need Besi Die Bond: Type: Datacon 2200 Evo 8800FC ,2200 APM+
Industry News | 2024-08-12 17:16:30.0
Bidding Begins Closing: August 14 @ 1:00pm EST
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
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