Electronics Forum | Fri Nov 12 10:40:17 EST 1999 | Dave F
Some under-the-hood automotive people have moved from no-clean to clean, and I mean CLEAN, recently. Hmmmm Dave F
Electronics Forum | Wed Mar 15 21:57:16 EST 2000 | Dreamsniper
DaveF, Thanks to all the support you were providing me. Appreciate all the help. Armin
Industry News | 2012-11-07 11:01:55.0
IPC and SMTA jointly announce the agenda for Session 6 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2022-01-14 17:06:40.0
Expanded technical conference award categories include NextGen and Student Research
Technical Library | 2017-10-12 15:45:25.0
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ferrite-beads-in-chip-packaging_topic679_post2325.html
... F OOTPRINT NAMING CONVENTION FOR NON-STANDARD PTH COMPONENTS ... Ferrite Beads FB _Mfr.'s Part Number Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined
Baja Bid | https://bajabid.com/author/baja1728/page/2/
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