Electronics Forum | Sat Apr 17 07:31:50 EDT 1999 | Brian Ellis
Cunli First of all, my message was intended to be forceful without intention of it being insulting or tonally "questionable". This is a problem with the Internet in that it is too easy to "flame" without the intention of doing so. Perhaps, your reg
Electronics Forum | Tue Sep 04 12:53:47 EDT 2001 | seand
Hey Dave and Company, Wow.....ya leave for a few days without loggin on and see what happens? I can say I am honestly amused. Sorry, no scams here...one name, one guy......process comes first...point noted. Never thought my name and Kerry's wou
Industry News | 2018-03-01 19:13:43.0
In recognition and acknowledgement of his extraordinary contributions to IPC and the electronics industry, Dave Hillman, Rockwell Collins, was presented with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO on Tuesday, February 27 at the San Diego Convention Center. IPC’s most prestigious award, the Hall of Fame is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.
Industry News | 2012-10-29 09:36:36.0
IPC and SMTA jointly announce the keynote speaker and the topics you need to hear during session 6 of the IPC/SMTA High Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
SMTnet Express, January 5, 2014, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Last Will And Testament of the BGA Void Dave Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, Ross Wilcoxon - Rockwell Collins
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
, Heather McCormick, Peter Read, Richard Popowich, and John Osenbach, “The Influence of Solder Void Location on BGA Thermal Fatigue Life,” Proceedings of SMTAI 2010, 132-140, Orlando, FL, October 2010. [16] David Hillman, Dave Adams, Tim Pearson, Brad
