Industry Directory | Distributor
You've got problems? We've got parts!! We help keep production lines up and running & take the stress out of procurement. SolTec offers strategic procurement solutions for your supply chain.
Industry Directory | Research Institute / Laboratory / School
MUAnalysis is an independent lab for Component Failure Analysis and Reliability Testing in Ottawa, Ontario Canada. We also would be pleased to discuss your analysis needs. We also perform all non-destructive testing ...
New Equipment | Rework & Repair Equipment
MLT provides laser decapsulation, "decap", services for removing encapsulation or mold compounds for accessing wirebonds, die, leadframes, and substrates.
Left: This part looked ok to the naked eye. Right: A microscopic view shows evidence of this part being previously soldered or reworked. Another part caught and prevented from being a potential problem for our customer. Decapsulation, Pinpri
Electronics Forum | Tue Nov 24 13:55:17 EST 1998 | trien pham
I have a COB device that I need to decapsulate for failure analysis. I would like to find out how I can do it using common materials/process that I can easily find. Thank you and I look forward to hearing from you soon.
Electronics Forum | Mon Nov 30 20:39:15 EST 1998 | Dave F
| I have a COB device that I need to decapsulate for failure analysis. | | I would like to find out how I can do it using common materials/process that I can easily find. | | Thank you and I look forward to hearing from you soon. | Trien: Level
Industry News | 2012-10-10 17:26:45.0
SMTA and CALCE are pleased to announce that the program is finalized for the Counterfeit Electronic Parts and Electronic Supply Chain Symposium West. The program is available on-line at www.smta.org/counterfeit and registration is open
Industry News | 2012-05-15 11:14:08.0
Tom O’Connor, DFR Solutions, will present a paper on the topic of counterfeit components.
Technical Library | 2019-06-18 10:18:00.0
ACI Technologies is tasked with decapsulation of electronics components for testing and investigative purposes. In the normal method of decapsulation, an analyst will drill a small indentation, with a rotary tool, in the hermetic sealant material and then apply Nitric acid to eat through the polymeric encapsulant.
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
