Electronics Forum | Thu May 17 06:46:39 EDT 2018 | godless
After fresh install and loading only machinekey + stdeaf files it worked, thanks. But still there is camera problem which appeared from the beginning. I attached files where you can see error details. Software reinstallation not solved issue. Then ca
Electronics Forum | Wed Aug 03 10:56:47 EDT 2011 | cyber_wolf
We have a new MPM Momentum. It's hands down the best printer we have ever worked with. Load program--add paste---forget about it. Runs every day all day with no issues what so ever. I come from a "machine background" and the MPM's are much more robus
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2018-10-18 11:23:54.0
6 Things to Check Before Submitting Your PCB Design for Manufacturing
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Career Center | Hawthorne, California USA | Production
MANUFACTURING SPECIALIST (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively develop
Career Center | Derabassi, India | Maintenance,Management,Production,Quality Control,Sales/Marketing
PCB Assembly (SMT & PTH)--Process/Planning – Production – Maintenance/Troubleshooting – QA/QC
Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
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package size became progressively smaller. For this reason it is necessary to take a different and more robust approach. The traditional method addressed the normalized load on the component during placement, but it cannot effectively account for the initial impact spike
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