Automatic Glue Dispenser DMDJ331 Features ▶Humanized design, Chinese hand-held teaching box operation, convenient programming, easy to learn; ▶ It has the functions of drawing points, lines, surfaces, arcs and various irregular curves continuously a
Automatic Glue Dispenser DMDJ331 Features ▶Humanized design, Chinese hand-held teaching box operation, convenient programming, easy to learn; ▶ It has the functions of drawing points, lines, surfaces, arcs and various irregular curves continuously a
Electronics Forum | Thu Jan 19 21:43:33 EST 2006 | davef
Specifically, what element of the bare board is blistering? Tg of 140 could be acceptable. Search the fine SMTnet Archives for background on decomposition temperature [td]
Electronics Forum | Tue Aug 09 10:02:07 EDT 2005 | davef
Td or Decomposition Temperature (the temperature that the epoxy actualy starts to break down) should be greater than 330*C for lead-free. Search the fine SMTnet Archives for more on Td.
Used SMT Equipment | In-Circuit Testers
Fluke 8508A 8.5 Digital Reference Multimeter The Fluke 8508A is an 8.5-digit resolution instrument designed specifically for metrologists. With superior accuracy and stability over a wide range of measurements the 8508A is designed to serve as
Industry News | 2019-03-13 10:39:34.0
Murray Percival Company today announced its spring sale of the of the ADS200, the industry’s newest high-power, low-cost production soldering system from PACE.
Parts & Supplies | Assembly Accessories
NO. GREASE MODEL PACKAGING 1 Three Bond 2706 Oil & Grease Removing Agent 420ML/PC 10PC/Carton 2 BIRAL T&D spary lubricant 500ML/PC 12PC/Carton 3 BIRAL VG-HT spary lubricant 500ML/PC 12PC/Carton 4 BIRAL BIO-30 high temperature chain oil 1000G
Parts & Supplies | Assembly Accessories
NO. GREASE MODEL PACKAGING 1 Three Bond 2706 Oil & Grease Removing Agent 420ML/PC 10PC/Carton 2 BIRAL T&D spary lubricant 500ML/PC 12PC/Carton 3 BIRAL VG-HT spary lubricant 500ML/PC 12PC/Carton 4 BIRAL BIO-30 high temperature chain oil 1000G
Technical Library | 2021-11-03 16:49:59.0
Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.
Visit the ADS200 Webpage for pricing and more information. https://www.paceworldwide.com/products/soldering-stations/digital-control-soldering-systems/ads200-accudrive-production-soldering-station-with-td200 The New ADS200 AccuDrive™ Production Sold
The SX-100 Sodr-X-Tractor is the solder extraction handpiece for high volume operations. It uses PACE's new SX-100 desoldering tips, the longest lasting desoldering tips availible on the market today. The SX-100 features a disposable collection chamb
ORION Industries | http://orionindustries.com/pdfs/mylarel21.pdf
. Typical Properties Mylar® films offer high dielectric strength, good chemical resistance, and exceptional durability in high-temperature environments
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/fluxless-reflow-1.pdf
enters the process chamber with inert atmosphere Formic acid vapor is introduced into the process chamber Product is heated above the solder liquidous temperature Product is cooled and exits the tool
