Electronics Forum: defect bga in vapor phase (5)

Vapor phase versus forced convection

Electronics Forum | Mon Aug 16 20:19:10 EDT 2004 | Grant

Hi, We have both Vapor Phase ASSCON semi auto as well as Soltec convection inline ovens. I must say we had no end of problems with Vapor Phase. We tried everything, and just could not totally eliminate tomb-stoning completely. We would always get a

Need Help with BGA Soldering in PoP Assembly

Electronics Forum | Fri Dec 27 17:18:37 EST 2024 | SMTA-71155914

It sounds like the lower BGA isn’t getting enough heat during the reflow process, likely due to the upper component in the PoP assembly blocking some of the heat. First, double-check the thermal profile to make sure it matches the solder paste specs—

Industry News: defect bga in vapor phase (8)

Come. Focus. Participate in the industry's best conference. The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference.

Industry News | 2010-05-07 16:01:14.0

New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.

Surface Mount Technology Association (SMTA)

SMTA International Call for Papers

Industry News | 2010-02-17 18:45:59.0

The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.

Surface Mount Technology Association (SMTA)

Events Calendar: defect bga in vapor phase (2)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Express Newsletter: defect bga in vapor phase (631)

Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints

Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published

Partner Websites: defect bga in vapor phase (31)

Wicking Defects-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23569&url=_print

. It robs solder from the interconnection, and is usually caused by uneven heating between the materials being joined. This is seldom observed in convection dominant reflow and was more a trait in older IR dominant reflow and vapor-phase technologies

Call for Papers | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm

/ Corner Glue/ Other Polymeric Reinforcements Vapor Phase Reflow Yield Improvement Business/Supply Chain: Capacity Modeling Conict Minerals Contract Manufacturing Counterfeit Parts Doing Business in Overseas Environmental Issues Lean Manufacturing Onshoring Operations Management Part Obsolescence RoHS

Surface Mount Technology Association (SMTA)


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