New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
New Equipment | Assembly Services
Hanwha HM520 SMT Assembly Line Hanwha HM520 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 80000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place ma
Electronics Forum | Thu Nov 27 21:25:15 EST 2003 | Al Capone
Has anyone in this forum experience the can soldering defect? The can component is supposed to be placed on top of a group of RF components to protect the frequency from escaping and interfere with the adjacent RF component. After the reflow process,
Electronics Forum | Fri Jun 07 14:05:39 EDT 2024 | davidk
I wanted to open a discussion and ask about opinion: What is a normal result of the inspection of an AOI? How many falls calls per component /opportunity is bad/normal/good? How many defects per component/opportunity is bad/normal/good? What is goo
Used SMT Equipment | AOI / Automated Optical Inspection
Key Features Ultimate Solution for Inspection Challenges Circuit boards are becoming more complex with new products. An AOI machine is becoming even more crucial to the electronics manufacturing lines. The industry has many2D, 2.5D and pseudo
Used SMT Equipment | AOI / Automated Optical Inspection
Key Features Ultimate Solution for Inspection Challenges Circuit boards are becoming more complex with new products. An AOI machine is becoming even more crucial to the electronics manufacturing lines. The industry has many2D, 2.5D and pseudo
Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Technical Library | 2016-05-30 22:24:00.0
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.
The TR7500QE AOI offers high performance 3D solder and assembly inspection by combining the next generation multi-angle 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection and 4 side view cameras. Latest inspection softwa
The TR7700QE AOI offers high performance 3D solder and assembly inspection by combining the next generation 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection. Latest inspection software ensures quick CAD-based programmi
Career Center | Killdeer, North Dakota USA | Quality Control
Summary of Responsibilities: The purpose of this position is to provide guidance and support to the Quality Department in the area of the Site Quality Managers responsibility and to provide a work environment where coworkers have the tools, trainin
Career Center | chennai, India | Engineering,Maintenance
Nokia India Pvt LTD. Sriperumpudur – Board Assembler Maintenance Technician from Sep 2009 to till now. Machines Handled Pick & Place : FUJI NXT Machines FUJI NXT - M3 II ,M3S. Reflow oven: Hot flow 3/20, 2/14. Stencil Pr
SMTnet Express, June 2, 2016, Subscribers: 24,776, Companies: 14,803, Users: 40,361 Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement Zhen Feng, Ph. D., David Geiger, Weifeng Liu, Ph. D
