New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
New Equipment | Assembly Services
Hanwha HM520 MF SMT Assembly Line Hanwha HM520 MF SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 60000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and pl
Used SMT Equipment | AOI / Automated Optical Inspection
Key Features Ultimate Solution for Inspection Challenges Circuit boards are becoming more complex with new products. An AOI machine is becoming even more crucial to the electronics manufacturing lines. The industry has many2D, 2.5D and pseudo
Used SMT Equipment | AOI / Automated Optical Inspection
Key Features Ultimate Solution for Inspection Challenges Circuit boards are becoming more complex with new products. An AOI machine is becoming even more crucial to the electronics manufacturing lines. The industry has many2D, 2.5D and pseudo
Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Technical Library | 2016-05-30 22:24:00.0
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.
AI-powered AOI Solutions Reduce False Calls and Escapes LEARN WHY MORE THAN ONE IN THREE AOI MACHINES INSTALLED IS FROM KOH YOUNG AI-powered True 3D AOI Solutions from Koh Young help manufacturers achieve zero-defect Production. The portfolio of A
The TR7700QE AOI offers high performance 3D solder and assembly inspection by combining the next generation 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection. Latest inspection software ensures quick CAD-based programmi
Career Center | Killdeer, North Dakota USA | Quality Control
Summary of Responsibilities: The purpose of this position is to provide guidance and support to the Quality Department in the area of the Site Quality Managers responsibility and to provide a work environment where coworkers have the tools, trainin
SMTnet Express, June 2, 2016, Subscribers: 24,776, Companies: 14,803, Users: 40,361 Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement Zhen Feng, Ph. D., David Geiger, Weifeng Liu, Ph. D
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/electronics-assembly-and-packaging?page=25
% smaller form factor. Nordson EFD X-ray Inspection Criteria & Common Defect Analysis The definitive guide to understanding electronics manufacturing defects using X-ray inspection is back for a second edition
| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
) Tombstone -- ramp up too fast The PCB and components didn’t get an even heat up. Void -- ramp up too fast The solvent in flux escaped too quickly
