TianHao company offer a full range of fluid dispensing equipment and consumable that provide the quality results you demand. and Complete robotic dispensing solutions and high precision systems.
New Equipment | Assembly Services
> 6Spindle, 6 Flying Vision (FOV 24mm) Head -Batch recognition with 6 cameras while picking up 6 components -Processable components: 0402 ~ 21mm, H12mm >> Low-noise, low-vibration high-speed placement with Linearmotor -Suitable for Y-axis Linear Moto
New Equipment | Assembly Services
Hanwha HM520 MF SMT Assembly Line Hanwha HM520 MF SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 60000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and pl
Industry News | 2018-12-08 03:27:35.0
Printed Circuit Board (PCB) for Surface Mount Technology (SMT)
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Technical Library | 2015-12-23 16:57:27.0
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Career Center | , Mississippi USA | Engineering,Production
About The Company: This company is a supplier of aerospace and defense products to the U.S. Government and its allies and major prime contractors. This company holds market leadership positions in munitions, smart weapons and precision capabilities
Career Center | Houston, Texas USA | Engineering,Management,Production
SMT Manufacturing Engineer – 2nd Shift Hunting Innova is a Houston based company serving industrial, energy, medical, defense and aerospace segments of the Electronic Manufacturing Services (EMS) Industry since 1989. Hunting Innova is located in N
Career Center | Sto. Tomas, Batangas, Philippines | Engineering
SKILLS & EXPERIENCES A.Materials engineering and management 1.Handles matters about materials -Ceramic and laminate substrates & Surface Mount Devices (SMDs) i.e. chip capacitors and resistors -Perishable materials i.e. solder paste (including Pb-fr
Career Center | Norco, California USA | Quality Control
JUDY RAE BROWN 4525 Temescal Ave. Norco, California 951 735-8416 cell 909-772-8646 e-mail judyrae1@sbcglobal.net Objective A chal
the defect rate of the measured machine. For exampl
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 1 Page 3 >> Knowing the capability coefficients, it is possible to estimate the defect rate of the measured machine. For example, Cpk = 1
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
Coating and Potting Connector Assembly to PCB DFX/Design for Six Sigma Direct Chip Attach to PCB (DCA) Dispensing & Underfill Epoxy Fluxes Facility Layout Halogen and Halogen-Free Head on Pillow Defect/Warpage Induced Solder Joint Defects High Melting Point Solder Laser Soldering Leadless Area Array Packages Lead
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/gauges-and-instruments?con=t&page=4
Performus X Series Fluid Dispensers are Built Tough for Industrial Use Nordson EFD Ideal for syringe barrel dispensing of glue, oil, grease, epoxy, cyanoacrylate, solder paste, and other assembly fluids, the
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