Electronics Forum | Thu May 10 18:23:50 EDT 2007 | wayne123
I was just wanting to know some of the advantages/disadvantages of going gold immersion? Is this neccessary for Lead free?
Electronics Forum | Fri May 18 15:41:40 EDT 2007 | wayne123
thanks for the input Rob, I apprieciate the help
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Technical Library | 2013-01-18 02:42:14.0
ENIG (Electroless Nickel/Immersion Gold) is to deposit nickel gold plating which has good solderability, wear resistance , leveling appearance and small electric resistance. It included 4 steps that are pretreatment, immersion nickel, immersion gold and Post treatment...
Technical Library | 2015-11-25 14:15:12.0
In this study various printed circuit board surface finishes were evaluated, including: organic solderability preservative (OSP), plasma finish (PF), immersion silver (IAg), electroless nickel / immersion silver (ENIS), electroless nickel / immersion gold hi-phosphorus (ENIG Hi-P), and electroless nickel / electroless palladium / immersion gold (ENEPIG). To verify the performance of PF as a post-treatment option, it was added to IAg, ENIG Hi-P, and ENEPIG to compare with non-treated. A total of nine groups of PCB were evaluated. Each group contains 30 boards, with the exception on ENIS where only 8 boards were available.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Viktoria Rawinski Abstract 31-2 Understanding the Higher Wire Bond Strength Advantage of Au/Pd/Au (IGEPIG) as Compared to Alternate Immersion Gold Finishes, Before and After Heat Treatment with Different Types of Wires Tatsushi Someya, Tetsuya Sasamura, Ph.D
Heller Industries Inc. | https://hellerindustries.com/surface-mount-technology-soldering-equipment-company-of-the-year/
Company of the Year Soldering Equipment - Heller Home » Company of the Year Soldering Equipment Company Of The Year Award (Soldering Equipment) 30th October, 2020 The 2020 Global Surface Mount Technology Soldering Equipment Award
