The world's first and only combo system with simultaneous 3D AOI and 3D AXI. It’s a unique solution for maximum efficiency and flexibility in PCB inspection, combining extreme reliability and effective process control. Optical and simultaneous 2-D,
The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solde
Electronics Forum | Sun Mar 22 15:29:01 EST 1998 | Michael Fogel
What is the right way to count the opportunities for defects in order to calculate the quality (in ppm) of SMT assembly processes as well as the quality of the PCB's? Please replay to: fogel_m@netvision.net.il or micha.fogel@ecitele.com
Electronics Forum | Fri Mar 07 10:55:51 EST 2008 | slthomas
Not sure if you need help with the calculations or the application, so from the beginning: d=defective parts, p=number of parts, dpm=defects per million parts In a nutshell, d/p=dpm/1000000, so dpm=d/p*1000000 We use dpmo (defects per million op
Used SMT Equipment | X-Ray Inspection
• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st
Used SMT Equipment | SPI / Solder Paste Inspection
SKU 16529 • Fastest solder paste inspection (SPI) system • Excellent 3D inspection • 3D SPI system for mid- to high-volume manufacturing • Great inspection ability of lead-free manufacturing process and fine-pitch/01005 compon
Industry News | 2003-05-02 08:49:07.0
Group to Assemble Data by Package and Technology Type
Industry News | 2010-12-01 14:28:16.0
With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.
Technical Library | 2023-08-02 18:18:23.0
As six sigma (6) and better processes are demanded for higher yields and as organizations move from measuring defects in terms of parts-per-million (ppm) towards parts-per-billion (ppb), the resolution of extant control charts is becoming insufficient to monitor process quality. This work describes the development of a new statistical process control (SPC) chart that is used to monitor processes in terms of defects-per-billion-opportunities (dpbo). A logical extension of the defects-per-million-opportunities (dpmo) control chart, calculations used to derive the dpbo control limits will be presented and examples of in-control and out-of-control processes will be offered.
Technical Library | 1999-05-07 10:14:57.0
This paper describes a model developed to calculate number of redundant good die per wafer. A block redundancy scheme is used here, where the entire defective memory subarray is replaced by a redundant element. A formula is derived to calculate the amount of improvement expected after redundancy. This improvement is given in terms of the ratio of the overall good die per wafer to the original good die per wafer after considering some key factors.
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The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Events Calendar | Mon Aug 10 00:00:00 EDT 2020 - Mon Aug 10 00:00:00 EDT 2020 | ,
Monitoring & Bench marking Your Processes and Assembly Yields
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
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Soldering Technician, Touch-up for PCBAs Perform hand soldering and touch-up rework for Printed Circuit Board Assemblies (PCBA), cables and associated equipment. Inspect PCBA for defects, loose connections, missing components. Solder to perform r
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Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
| http://etasmt.com/cc?ID=te_news_industry,23962&url=_print
. Also, low solder volume can cause solder defects. Is the stencil designed for the PIP process? To get enough paste to fill up the pin hole, the stencil aperture must be designed bigger than the solder pad size depending upon the paste volume calculation
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/news-releases/nordson-corporation-reports-2013-fourth-quarter-and-full-year-results
effects of currency translation. Fourth quarter operating profit was $87 million, net income was $60 million and GAAP diluted earnings per share were $0.92
