Industry Directory | Manufacturer
Arizona ProCoat leads the industry in precision painting, conformal coating, potting and bonding
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SMT Samsung CP feeder 8x2mm, PA-NST for 01005 pick and place machine Samsung SM/CP40 CP45 Feeders models: SAMSUNG SM 8*2mm FEEDER SAMSUNG SM 8*4mm FEEDER SAMSUNG SM 12mm FEEDER SAMSUNG SM 16mm FEEDER SAMSUNG SM 24mm FEEDER SAMSUNG SM 32mm FEEDER SAM
SMT Samsung 12mm embossed for SM series pick and place machine Samsung SM/CP40 CP45 Feeders models: SAMSUNG SM 8*2mm FEEDER SAMSUNG SM 8*4mm FEEDER SAMSUNG SM 12mm FEEDER SAMSUNG SM 16mm FEEDER SAMSUNG SM 24mm FEEDER SAMSUNG SM 32mm FEEDER SAMSUNG S
Electronics Forum | Mon Dec 17 09:38:27 EST 2012 | cyber_wolf
Why scrap paste if there is no degradation of performance? Do your own study to determine this.
Electronics Forum | Wed Jul 17 11:52:54 EDT 2002 | tmarc
Hello all, I have a question about OSP. The solder mask over traces leading to SMT pads, in some instances, does not cover all the way to the pad. Of course the stencil apertures do not include traces. After the SMT and reflow process, there is visib
Used SMT Equipment | Screen Printers
DEK 03iX Specs: • Process alignment capability 2 Cpk @ ± 25µm 6-Sigma • Machine alignment capability 2 Cpk @ ± 12.5µm 6-Sigma • 12 second cycle time • High Throughput Conveyor (option) , enables core cycle time reduction to just 11 seconds • DE
Used SMT Equipment | Screen Printers
# Green camera :fully programmable lighting system w/ direct, indirect, oblique lighting # DEK Blue understencil cleaner :Standard under stencil cleaning system comprises wet, dry and vacuum strokes to remove excess paste from stencil apertures, prev
Industry News | 2018-04-18 18:06:14.0
SMTA Europe announces Session 6 Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Parts & Supplies | Pick and Place/Feeders
XPF 44mm Electric Feeder W44C W44 used in pick and place machine XPF 44mm Electric Feeder W44C W44 used in pick and place machine Feeder performance will degrade without proper maintenance. Regular cleaning, lubrication,and calibration are essenti
Parts & Supplies | Pick and Place/Feeders
00141099 Siemens feeder 3x8mm Gold FEEDER Specification Part Numbre 2x8mm FEEDER 00141096 3x8mm Gold FEEDER 00141099 3x8mm Silver FEEDER 00141098 3x8mm SL FEEDER 00141088 12/16MM FEEDER 00141092 24/3
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 1999-05-06 15:31:13.0
Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. the speed and severity of degradation depends both on storage conditions and on the plating itself...
The natural sustainable desiccant solution for moisture controlled packaging Desiccants are hygroscopic (moisture-adsorbent) substances that are packaged and used to protect a broad range of products from degradation due to moisture, helping to main
Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Wed Aug 19 00:00:00 EDT 2020 - Wed Aug 19 00:00:00 EDT 2020 | ,
DfR - Design for Rinse-Ability: Effect of SMT Component Package Design on Cleaning Effectiveness
Events Calendar | Tue Apr 28 00:00:00 EDT 2020 - Tue Apr 28 00:00:00 EDT 2020 | Halle (Saale), Germany
Keynote Presentation at 9th CAM Workshop: Physics of Failure Approaches and their Relevance and Applicability for Reliability Investigations and Qualifications especially in real Automotive Electronics
Career Center | Killdeer, North Dakota USA | Human Resources
SUMMARY OF RESPONSIBILITIES: The Human Resource Director position requires a clear understanding and practice of KMM’s mission, vision, values, and strategies. This function requires an intimate knowledge of KMM’s policies and procedures and the abi
Career Center | Killdeer, North Dakota USA | Quality Control
Summary of Responsibilities: The purpose of this position is to provide guidance and support to the Quality Department in the area of the Site Quality Managers responsibility and to provide a work environment where coworkers have the tools, trainin
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/application-solutions/uv-curing/medical-devices
. The absence of heat generation using UV does not degrade lubricious coatings. This assures that the guide wires that push along artery walls maintain superior quality
| https://www.eptac.com/soldertips/issues-of-burnt-flux-on-class-3-pcb-assemblies/
won’t hurt or degrade the product if left on the boards after soldering. Fully active fluxes, if left behind, are susceptible to the absorption of moisture which is a problem when the product is in the field as the flux residues are still active and when moisture is
