Industry Directory | Manufacturer
The ASM SMT Solutions segment is made up of SMT Printing Solutions (DEK) and SMT Placement Solutions (SIPLACE). Under the DEK brand, it sells best-in-class printing solutions for the electronics and solar industries.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
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New Equipment | Solder Paste Stencils
EbyDEK printer specification： ①Automatic Fiducial Setup ②Fast Print Speed ③Networking ④Small Fiducial ⑤Speed Up ⑥Tooling Deviation Monitoring ⑦Vision Plus ⑧Windows 7 Operating System Specify ①Blue USC Alternative Park ②DUI Hardware And Time To Go
Electronics Forum | Fri May 29 06:50:04 EDT 2015 | buckcho
Hello, can you explain better what do you want to check? Alignment is done based on fiducial check and then you can do some offsets, based on the print. So I am not sure what do you want to say...
Electronics Forum | Tue Mar 20 18:28:26 EDT 2018 | dekhead
Print Head Stroke Calibration?
Used SMT Equipment | Screen Printers
EbyDEK printer specification： ①Automatic Fiducial Setup ②Fast Print Speed ③Networking ④Small Fiducial ⑤Speed Up ⑥Tooling Deviation Monitoring ⑦Vision Plus ⑧Windows 7 Operating System Specify ①Blue USC Alternative Park ②DUI Hardware
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Industry News | 2003-03-28 08:24:43.0
The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.
Industry News | 2003-06-16 08:33:59.0
This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.
Parts & Supplies | SMT Equipment
MPM AP series about squeegee pressure Name: P1666; MPMAP series about squeegee pressure control card Part Number: P1666 Description: P1666; MPM AP series about squeegee pressure control card Applicable models: UP; AP Printing Presses P1666;
Parts & Supplies | Screen Printers
Name: P1827 MPM air pressure sensor; MPM APS air pressure switch Part Number: P1827 MPM APS sensor Description: P1827 MPM air pressure sensor; MPM APS air pressure switch; MPM APS sensor; Module, Pneum Electric, Pressure Switch Applicable mod
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Fremont, California USA | Production,Quality Control
Local industry leading EMS Company seeking SMT operators. Will be doing SMT line Change overs, SMT machine operation for solder printing, placement, reflow. Solder paste height measurement and record. Solder printing quality check after solder paste
Career Center | Alachua, FL, USA | Production
Manufacturer seeks experienced SMT Machine Operator. Job requirements are: Operate, maintain and program automated and semi-automated equipment used in printed circuit board assembly. Experience with DEK screen printers and Assembleon Opal machine
Career Center | Poway, California USA | Engineering,Production
Technically qualified in proper operation, troubleshooting, installation /dismantling, programming and preventive maintenance of SMT (Surface Mount Technology) machines. Productivity and quality for the production of PCBA (Printed Circuit Board Ass
Career Center | , | 2013-03-07 10:18:07.0
Currently work as Equipment Engineer at Integrated Microelectronics Inc., Philippines handles Line Maintenance Technicians, that performs production equipment setup and sustenance. Implements/creates improvements on assigned area. Maintains group KRA
SMTnet Express, March 8, 2018, Subscribers: 31,288, Companies: 10,911, Users: 24,465 Optimization of Stencil Apertures to Compensate for Scooping During Printing Gabriel Briceno, Ph. D., Miguel Sepulveda; Qual-Pro Corporation This study
SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea Over the past decade, depositing adhesives for SMT components
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DEK Print Carriage Motor 133126 - SMT Xtra About Us Contact SMT XTRA +44 (0) 1302 247295 HOME SMT NOZZLES ASM (Siemens) Siplace Assembleon / Philips FUJI HITACHI IPULSE JUKI MIRAE PANASONIC SAMSUNG SANYO SONY UNIVERSAL YAMAHA SMT FEEDERS ASM (Siemens
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DEK print machine DEK 145009 265GSX COGNEX VISION CARD dek smt screen printer parts Leave a Message We will call you back soon
