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CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC, Datacon), Kulicke & Soffa, Hesse & Knipps, F&K Delvotec, Orthodyne, ASM, Dage and others. CMTec delivers 'turn-key' projects worldwide.
3D Printers Rapid Prototyping Equipment Semiconductor Equipment - Rework Stations - Wire Bonders - Palomars, Orthodyne, Delvotec
Electronics Forum | Fri Jan 20 02:34:16 EST 2006 | yihui
Hi, i'm david, new to this forum. Came across your posting about using a delvotec bonder to TS bond to a ENIG pad. Given that the immersion gold layer is thin, does the capillary scrub through the gold layer to expose the underlying nickel? Does your
Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow
Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w
| https://productronica.com/de/messe/presse/pressemitteilungen/detail/gruenes-licht-fuer-productronica-2021.html
führende Key Player wie ASM Assembly Systems, F&K Delvotec, Komax, sowie Kurtz Ersa und Rohde & Schwarz vertreten. Für interessierte Firmen besteht nach wie vor die Möglichkeit, sich