Industry Directory | Consultant / Service Provider
Elmet LLC is an accredited lab, primarily providing cross sectioning of circuit boards, visual and x-ray inspections of PCBAs and other metallographic and metallurgical services including SEM examination and EDS analysis.
New Equipment | Test Equipment
AutoCAF™ is able to measure up to 256 individual measurement sites under conditions of high humidity and temperature in accordance with IPC-TM-650 2.6.25 Test Method & IPC 9691 CAF Test Users Guide. Conductive anodic filament (CAF) failure is copper
Electronics Forum | Mon Feb 18 22:05:58 EST 2008 | callckq
Dear All, What is the possible root causes of the dendrite growth? How long its take to cause this dendrite growth? Can dendrite growth cause electrical short? Is there any particular location on PCBA that dendrite tend to grow? Thanks, Sean
Electronics Forum | Tue Feb 19 08:46:06 EST 2008 | rgduval
The last time I encountered dendrite growth, it was within a component package. I believe we were experiencing it within a crystal. The root cause was water intrusion during in line wash. The component was supposed to have been sealed and safe for
Industry News | 2012-10-18 19:02:31.0
IPC and SMTA jointly announce the agenda for Session 2 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel
Industry News | 2012-08-15 10:34:48.0
Aqueous Technologies Corp., North America’s largest provider of batch defluxing systems, announces that its CEO Michael Konrad will present “Electrical Leakage, Dendritic Growth, and White Residue – The Rush to Clean No-Clean” at the upcoming Cleaning and Reliability Workshop,
Technical Library | 1999-08-27 09:27:10.0
Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards.
Technical Library | 2019-06-03 15:32:40.0
ACI Technologies was pleased to assist a customer by conducting elemental analysis on several assemblies displaying severe corrosion. Several board assemblies had failed in the field and exhibited areas of corrosion in close proximity to onboard components. The most common source of corrosion on electronic assemblies is residual flux. Fluxes are specific chemistries applied during the soldering process which improve the wetting of the solder to both the pad and component when forming the solder joint. They can be highly reactive chemicals that, if left on the assemblies, can lead to corrosion, electrical degradation, and decreased reliability. In the presence of moisture and electrical bias, flux residue can enable dendritic growth as a result of electrochemical migration (ECM).
