Industry Directory | Consultant / Service Provider
Elmet LLC is an accredited lab, primarily providing cross sectioning of circuit boards, visual and x-ray inspections of PCBAs and other metallographic and metallurgical services including SEM examination and EDS analysis.
Industry Directory | Manufacturer
An EMS company. Services including Design, Prototype, Domestic and Off-Shore Assembly, High Level Assembly, Test solutions, Global Distribution and Continuing Product Support.
A global, business operations turnaround and growth management company, that supports the electronic manufacturing industry. Principals and associates have over 20 years of International experience in the electronics manufacturing space for both OEM'
Compared to conventional rigid PCB, FPC is not frequently needed from SysPCB. Because it is only used under occasions of bending or with thickness requirements. But it is a trend as smart phone and electrical watch is on market now, in these devices,
Electronics Forum | Mon Feb 18 22:05:58 EST 2008 | callckq
Dear All, What is the possible root causes of the dendrite growth? How long its take to cause this dendrite growth? Can dendrite growth cause electrical short? Is there any particular location on PCBA that dendrite tend to grow? Thanks, Sean
Electronics Forum | Tue Feb 19 08:46:06 EST 2008 | rgduval
The last time I encountered dendrite growth, it was within a component package. I believe we were experiencing it within a crystal. The root cause was water intrusion during in line wash. The component was supposed to have been sealed and safe for
Industry News | 2003-03-04 08:31:59.0
Ian Suttie To Drive Company's Expansion in Professional Printed Circuit Board Design Market
Industry News | 2003-02-26 09:24:48.0
Accelerated Technologies, a provider of rapid prototyping, tooling and electronic manufacturing services, has announced the acquisition of a new and larger facility in Austin, Texas.
Parts & Supplies | Pick and Place/Feeders
Starting in May 2008, ＪＵＫＩ Corporation (President Kazuyuki Nakamura; listed on First Section of the Tokyo Stock Exchange) is beginning worldwide sales of its High-speed Modular Mounter FX-3. The FX3 is an industrial robot for mounting electronic comp
Technical Library | 1999-08-27 09:27:10.0
Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards.
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
Events Calendar | Thu Apr 07 00:00:00 EDT 2022 - Thu Apr 07 00:00:00 EDT 2022 | Palm Bay, Florida USA
Space Coast Chapter Technical Meeting: Printed Wiring Board Fabrication Design Attributes
Events Calendar | Wed Mar 20 00:00:00 EDT 2019 - Fri Mar 22 00:00:00 EDT 2019 | Shanghai, China
electronica China 2019 - International Trade Fair for Electronic Components, Systems and Application
Career Center | , Florida USA | Engineering,Management
Exceptional Medical Design Engineering Manager needed for rapidly expanding Medical ODM specializing in full medical class I, II, & III product conceptual design through manufacturing. This is your chance to work with a leading medical device orig
Career Center | Fort Walton Beach, Florida USA | Engineering
Are you passionate about Test Engineering? Do you have an Electrical background? The Electronics Group of Crane Aerospace & Electronics designs and manufactures high-density, high-reliability electronics for our aerospace, space, military, me
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
Career Center | north augusta, South Carolina USA | Production,Quality Control
I am a skilled smt operator that pays close attention to detail! With my experience in the electronic field for the passed 10 years proving to be an asset to all companies that i have worked for in providing quality work and ensuring on time delivery
| https://unisoft-cim.com/history.php
). Prior to SMT creating a test fixture "Bed of Nails" to interface with a PCB assembly ( PCBA ) under test was an easy task, SMT however change this by creating no test probe access, probe spacing constraints, etc
