Electronics Forum | Mon Feb 10 21:39:39 EST 2025 | stephendo
This page has information https://nepp.nasa.gov/whisker/background/index.htm One thing that it says is that some people confuse the term "tin whiskers" with "dendrites". They are totally different things and the only thing in common is they each caus
Electronics Forum | Wed Apr 29 04:57:08 EDT 2009 | davepick
It depends on the application what will be considered the biggest issue to avoid (production or longterm reliability). Tin Whiskers are bit of an unknown quantity - but a more realistic problem could be dendritic growth / electromigration forming sho
Industry News | 2022-05-27 14:34:04.0
From battery fires to non-functional charging stations, from dendrites to poor cable connections, electronic system failures have caused massive recalls. Failures are increasing significantly, not because of quality, but because of usage and implementation of technology. As the expected lifetime usage of parts increases and technology applications change, materials, approaches, and test parameters must change as well.
Industry News | 2018-03-24 09:45:36.0
Dendrite failure on printed circuit board assemblies is quite common but often not investigated fully to pin point the root cause. This is due to the intermittent nature of the failure or just replacing components seems to solve the problem Book at https://www.bobwillis.co.uk/event/dendrite-failure-causes-cures/
Technical Library | 2009-10-14 21:17:47.0
Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias. ECM, also known as dendritic growth, is a critical issue in the electronics industry because the intermittent failure behavior of ECM is a likely root-cause of the high occurrence of field failures identified as no trouble found (NTF)/could not duplicate (CND)
