New Equipment | Fabrication Services
MAXI-FLEX® is designed for your specific application with signal, power and shielding layers in one complete interconnect package. All Flex Flexible Circuits is one of the few companies in the world offering extended length flexible circuits beyond
Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Technical Library | 2010-09-02 13:13:03.0
As chip packaging and interconnectivity have become more dense and operate at higher clock frequencies, physical access for traditional bed-of-nails testing becomes limited. This results in loss of ICT (in-circuit test) fault coverage and higher test fi
Technical Library | 2014-05-29 13:48:14.0
Electronics packaging based on stress-engineered spring interconnects has the potential to enable integrated IC testing, fine pitch, and compliance not readily available with other technologies. We describe new spring contacts which simultaneously achieve low resistance ( 30 μm) in dense 2-D arrays (180 ~ 180-µm pitch). Mechanical characterization shows that individual springs operate at approximately 150-µN force. Electrical measurements and simulations imply that the interface contact resistance contribution to a single contact resistance is This paper suggests that integrated testing and packaging can be performed with the springs, enabling new capabilities for markets such as multichip modules.
Harwin’s Gecko (G125 series) connectors provide a low profile, dual row cable-to-board and board-to-board interconnect solution, ideally suited for stacking and cable mating in areas where PCB real estate is at a premium. For more information and sa
Events Calendar | Sat Jul 06 00:00:00 EDT 2019 - Sat Jul 06 00:00:00 EDT 2019 | Chennai, India
Reliable Electronics for the Automotive Industry Technical Workshop
Whizz Systems | https://www.whizzsystems.com/wp-content/uploads/2023/08/FPGA-Hardware-Design-Case-Study.pdf
. FPGAs consist of a vast number of configurable logic elements, interconnects, and other resources. As designs become more complex and clock frequencies increase, it becomes challenging to ensure that signals propagate through the design within the required clock cycles
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. As the demand for high interconnect solutions at the circuit board level increase, there must be performance improvements in components, interconnects and substrates
