Industry Directory | Manufacturer
Trion provides versatile plasma equipment (ICP-RIE, PECVD, PVD, Ashers, and more) to enable our customers in the MEMS, Semiconductor, LED, RF Power, F.A., Opto-, III-V, Wafer Level Packaging, Thin Film Head, and Solar industries.
Industry Directory | Manufacturer
Synova is an experienced manufacturer of innovative laser cutting systems for an extraordinary range of micro-machining and dicing applications.
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
Stencils, metal mask tools used for the deposit of solder paste onto PC Board before component placement. Please call for the best process for your requirements.
Electronics Forum | Mon Nov 04 13:27:14 EST 2013 | pradeep_selec
Hi, How can the life of the stencil be decided? As the stencil is used contineously the thickness go on decreasing. How are you all deciding the life of stencil? As visually its dificult to deide the solder paste deposited thickness, is there any t
Electronics Forum | Thu Jan 09 10:58:30 EST 2003 | soupatech
Thanks for the input.... I ordered a 5 mil stencil AND used more tooling under the board. This gave me a much smaller deposit of solder. I wouldn't swear that was my problem but 96 boards later the problem is 99% gone. I believe there was just too mu
Used SMT Equipment | Screen Printers
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Used SMT Equipment | Screen Printers
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Industry News | 2013-01-28 02:11:23.0
Offers precise, repeatable dispensing of phosphor for coating and encapsulation
Industry News | 2010-03-27 19:26:29.0
BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
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Parts & Supplies | SMT Equipment
00370409-01 Micro-Transceiver RJ45/AUI AT-210TS-05 00370500-10 Software Linie LINUX 503/10(503.06)&OS 00370691-01 BELT MEASURING STRIPE 00370710-01 BRASS BRUSHER 00370731-02 LIGHT BARRIER TRANSM. APPL. BAND 00370735-02 LOCKED BOX 00370750-04 SI
Technical Library | 2009-09-09 15:08:19.0
Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers.
Technical Library | 2023-06-12 19:00:21.0
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented.
00370409-01 Micro-Transceiver RJ45/AUI AT-210TS-05 00370500-10 Software Linie LINUX 503/10(503.06)&OS 00370691-01 BELT MEASURING STRIPE 00370710-01 BRASS BRUSHER 00370731-02 LIGHT BARRIER TRANSM. APPL. BAND 00370735-02 LOCKED BOX 00370750-04 SI
To see more visit Pillarhouse here: https://www.pillarhouse.co.uk/products/selective-soldering-handload/pilot-handload Economical, compact, single point selective soldering system The all-new ultra-low-cost Pilot machine has been designed as an ent
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Career Center | Corpus Christi, Texas USA | Engineering,Production
Improve and expand capabilities related to thin film sputtering/CVD deposition as required by Operations and the Business Unit. This position reports directly to the Engineering Manager. Responsibilities: Continuous improvement of sputtered th
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Career Center | , Thailand | Maintenance,Production,Quality Control,Sales/Marketing
Has almost 4 years of experience working in mobile industry (NOKIA) and DELL computers as Sales Executive and Acting Showroom Manager. #1; Has more than 1 & half years of experience working in surface mounted technology industry as a project coordina
Dispensing Solder Paste Micro-Deposits If you don't see the images, please visit online version at #Application.SmtNet.baseURL#/express/ News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE
Imagineering, Inc. | https://www.pcbnet.com/blog/a-guide-to-pcb-inspection-methods/
. The most common errors are related to solder paste deposition. An excess of solder causes bridged circuits and shorts, rendering a printed circuit board non-functional
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