Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
Electronics Forum | Fri Sep 21 10:56:38 EDT 2001 | davef
Not as such. Look at IPC-7525 �Stencil Design Guidelines� The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.
Used SMT Equipment | AOI / Automated Optical Inspection
Really high quality used solder paste inspection with 1 year warranty Features BF-SPIDER - SOLDER PASTE INSPECTION DESCRIPTION: 1. The newly developed Phase Measurement Profilometer Technology ensures high inspection repeatability. 2. Advan
Used SMT Equipment | Soldering - Selective
ACE Production Technologies KISS 101A Selective Soldering System The KISS-101A is an entry-level selective soldering machine, manual load, 12″ x 12″ board size. Best suited for medium volume, smaller CM's for light to moderate duty. The KISS-101A
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Technical Library | 2023-06-12 19:07:04.0
In this article we will examine if there is a measurable difference in the printing performance when using stencils which have a higher tension than is commonly accepted in the industry. Alpha's new tensoRED™ High Tension Frame System will be introduced during this wider examination. We will examine their effect in terms of controlling variation in critical deposit volumes and what, if any effect on positional accuracy can be seen.
Technical Library | 2018-03-07 22:41:05.0
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. A typical bimodal percent volume distribution is attributed to poor release apertures and large apertures, where scooping takes place, yielding percent volumes 100%. This printing experiment is done with a concomitant validation of the printing process using standard 3D Solder Paste Inspection (SPI) equipment.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
The Vortik VPm Progressive Cavity Pump dispensing two-component materials for encapsulation.
Events Calendar | Tue Aug 11 00:00:00 EDT 2020 - Tue Aug 11 00:00:00 EDT 2020 | ,
SMTA/iNEMI Webinar: Non-Contact Additive Processes for Contemporary Electronics Production
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
SMT Express, Volume 2, Issue No. 6 - from SMTnet.com Volume 2, Issue No. 6 Wednesday, June 14, 2000 Featured Article Return to Front Page Process Control for Solder Flux Stacy KaliszMark OwenMVTechnology Ltd. ABSTRACT Flux used in ball grid
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
What Are Reflow Soldering Defects - Heller Home » What Are Reflow Soldering Defects Reflow Soldering Defects & Causes DEFECT / CAUSE RELATIONSHIP Coplanarity Contamination Metallurgy Solder Quality Solder Volume Reflow Profile Placement Accuracy Land Design Reflow Cycle Too Long Excessive Reflow Temp
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
. Drilling differs depending on the type of via being used , but generally is done on a stack of 2-3 panels at a time. The end result will generally be 5 mil larger than the end product, as these holes will be plated with copper to help send electrical signals through a process called electroless copper deposition
