MICROFOCUS X-RAY 3D/CT SYSTEM VX-9100 The VX-9100 3D X-Ray Inspection Machine is a state-of-the-art industrial microfocus CT system designed for precise quality inspection and non-destructive analysis of electronic components. Its advanced cap
Non-destructive infrared inspection system for circuit card assemblies. Uses high resolution infrared radiometers with WindowsNT software for image analysis.
Electronics Forum | Mon Feb 14 13:24:11 EST 2005 | recycling
Ha. I didn't know that there were problems viewing our site. Thank you for the feedback! If you have any inquiries pertaining to destruction or reclaim of your materials feel free to call. Gilberto Contreras United Recycling (800)323-1574
Electronics Forum | Wed Oct 05 14:23:50 EDT 2005 | chunks
What kind of destructive testing is anyone doing for LF BGAs?
Used SMT Equipment | Pick and Place/Feeders
Yamaha Mounter YSM10 basic specifications: 1. Target board size: L510 x W460 mm ~ L50 x W50 mm. Use optional accessories, can correspond to L610mm substrate 2, placement capacity: HM placement head (10 nozzles) specifications HM5 placement he
Used SMT Equipment | General Purpose Equipment
Year 2008 - Like New Condition Tyco SEP 3T Shuttle Electric Press Standalone electric press for the application of PCBs onto compliant pin housings or connectors • Servo electric press with shuttle system for product location under press ram • Ho
Industry News | 2003-07-09 09:00:46.0
He will have responsibility for all aspects of Photronics� manufacturing and sales activities in China, Singapore and Taiwan.
Industry News | 2019-03-25 19:02:23.0
IPC’s High Reliability Forum and Microvia Summit, a three-day technical conference to be held in Hanover, Md., May 14-16, will focus on electronics for mil-aero, automotive, and long-life applications.
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Parts & Supplies | Pick and Place/Feeders
FUJI XPF Vacuum Destruction PIN Fuji Mounter Parts 2AGGHB001400 Model: FUJI Mounter Specification: XPF vacuum destroy PIN Part number: 2AGGHB001400 Name: XPF Vacuum Destruction PIN 2AGGHB00100 AGGPH8601 FUJI XPF upper cover 2AGGHB001300 FUJI
Parts & Supplies | Assembly Accessories
Pressure SENSOR KXF0DQXAA00 DT401 SENSOR(N510025620AA) PRESSURE SENSOR N610026749AA VS1-4, KXF0DWVWA00, N610040037AA PRESSURE SENSOR N610027221AA VS5-8 PRESSURE SENSOR N610017022AD VS1-6 PRESSURE SENSOR N610017023AC VS7-12 CM402/C
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2023-01-23 20:50:05.0
PDC Outline Section 0: Intro Section 1: What is reliability and root cause? Section 2: Overview of failure mechanisms Section 3: Failure analysis techniques – Non-destructive analysis techniques – Destructive analysis – Materials characterization Section 4: Summary and closure
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
CX-3500 is use to examine internal solder joints, BGA, IC and other complex components.It adopts the structure of high resolution enhanced screen and sealed microcoking X ray tube combination, through X-ray non-destructive fluoroscopy, real-time obse
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Events Calendar | Thu Apr 22 00:00:00 EDT 2021 - Thu Apr 22 00:00:00 EDT 2021 | ,
Ohio Chapter Meeting: Industry 4.0 / Non-Destructive Failure Analysis
Career Center | Dallas, Texas USA | Engineering
Skills/requirments:BSEE or technical courses completed or equivalent, 5+years work experience, knowledge of all electrical parts (military and commercial) and have experience in electrical analysis and electrical testing of components. Strong commun
Career Center | Killdeer, North Dakota USA | Quality Control
Summary of Responsibilities: The purpose of this position is to provide guidance and support to the Quality Department in the area of the Site Quality Managers responsibility and to provide a work environment where coworkers have the tools, trainin
SMTnet Express, May 19, 2022, Subscribers: 25,528, Companies: 11,568, Users: 27,231 Electronics Manufacturing Technical Articles Non-Destructive Characterization of Mechanically Processed Waste Printed Circuit Boards: X
