Industry Directory | Manufacturer
Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.
Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
New Equipment | Test Equipment
Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
Electronics Forum | Mon Feb 08 17:11:34 EST 2010 | woodsmt
Thanks Dave and Glenn, I have setteled on Dye for the destuctive checks, and was thinking about impedence testing at intervals during ESS. Based on the research I have been doing the last several days, this seems like a method that should identify
Electronics Forum | Mon Feb 08 09:03:49 EST 2010 | woodsmt
Looking for methods for detecting BGA microcracks without cross sectioning. Currently evaluating a new package and will be putting together a thermal stress eval. We would like to perform intermediate inspections for cracks. Once all cycles are don
Used SMT Equipment | Pick and Place/Feeders
The unique mounting technology is embodied in: Advanced PCB collision detection No impact force = no component cracking Pressure control for placement of closed loop For small batch and multi-variety work orders, no need to disassemble FEEDER, the mo
Used SMT Equipment | Pick and Place/Feeders
The unique mounting technology is embodied in: Advanced PCB collision detection No impact force = no component cracking Pressure control for placement of closed loop For small batch and multi-variety work orders, no need to disassemble FEEDER, the mo
Industry News | 2018-10-18 09:27:40.0
Time Temperature setting wave soldering is the most important in the solder melts
Industry News | 2014-03-28 09:54:48.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas.
Technical Library | 2009-05-21 13:41:05.0
Failure due to board flex cracks persists as the dominant failure mode in multi-layer ceramic capacitors (MLCC). (...) This paper is intended to show the impact of temperature cycling, high-temperature life tests, and multiple bend exposures to the MLCC with this flexible termination.
Technical Library | 2013-01-03 20:27:54.0
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.
Shenzhen zhuomao is located in Shenzhen, China.SHENZHEN ZHUOMAO TECHNOLOGY CO.,LTD - Seamark Group The leading manufacturer of BGA/SMT rework, X-ray inspection system, TV LCD panel laser repair for 13 years in China. Established in 2005, we have coo
Conformal coatings used by electronic manufacturers contain UV indicators for the purpose of inspection. Since coatings are transparent, units must be viewed under black light in order to verify coverage and non-coverage. Quick set-up with Auto
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Failure due to board flex cracks persists as the do
SMTnet Express, December 6, 2018, Subscribers: 31,514, Companies: 10,684, Users: 25,477 Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates Credits: DfR Solutions The multilayer ceramic capacitor (MLCC) has become a widely used
