New Equipment | Cable & Wire Harness Equipment
Overview The SawPolish Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections. Three models for sawing and polishing a wide range of crimp connections Polishing disc is in line w
New Equipment | Cable & Wire Harness Equipment
Overview The SawPolish Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections. Three models for sawing and polishing a wide range of crimp connections Polishing disc is in line w
Industry News | 2016-09-22 18:12:16.0
Saki Corporation will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes.
SMTnet Express, June 20, 2024, Subscribers: 25,665, Companies: 12,179, Users: 29,072 █ Electronics Manufacturing Technical Articles Component Reliability After Long Term Storage Each year the semiconductor industry routes a
