Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen
Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-
Electronics Forum | Thu Feb 02 08:54:43 EST 2017 | emeto
Hello all, I was just wondering if solder pot temperature affects the quality or the life of the solder joints? For example we run 100Sn at 275C. If I bump it up to 300C, what is that going to change?
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
Industry News | 2010-09-27 23:01:06.0
Christopher Associates/Koki Solder announces that Jasbir Bath will present a paper titled “An Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Component Manufacturing Applications” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Technical Library | 2013-02-07 17:01:46.0
Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2008-11-06 02:17:59.0
For many years Acoustic Micro Imaging (AMI) techniques have been utilized to evaluate the quality of the underfill used to support the solder bump interconnections of Flip Chip type devices. AMI has been established as one of the few techniques that can provide reliability and quality control data, but little has been done to automate the evaluation process for Flip Chip underfill until now.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Featured Article Return to Front Page Soldering Technolo
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/cold-bump-pull
vertically remove the solder ball from a device or substrate by using patented tweezer jaws. Tests are performed in accordance with: JEDEC JESD22-B115 JEITA EIAJ ET-7407 IPC-9708 The cold bump pull jaws have a cavity etched into it to match as closely as possible to the diameter of the solder ball being tested
| http://etasmt.com/cc?ID=te_news_bulletin,23572&url=_print
. Check against manufacturer’s specifications. PCB Dewetting PCB Dewetting is a condition that results when molten solder has coated a surface and then receded, leaving irregularly shaped mounds of solder separated by areas covered with a thin
