Quik-Pak, a division of GEL-PAK, offers state of the art clean room manufacturing and enhanced product capabilities which include MLF and MLP IC plastic packages. Quik-Pak offers unlimited open cavity plastic package configurations. Quick-Turn dicing
Quik-Pak, a division of GEL-PAK, offers state of the art clean room manufacturing and enhanced product capabilities which include MLF and MLP IC plastic packages. Quik-Pak offers unlimited open cavity plastic package configurations. Quick-Turn dicing
Electronics Forum | Sat Jul 04 15:34:12 EDT 2020 | sara_pcb
Hi, I am designing a PCB which consist of Instrumentation Amplifiers, Programmable Gain Amplifiers, Switched Cap Filters, FPGAs & many ADCs. Involves low level Analog signals. How to patrician the layout so Analog & Digital signals do not interfere.
Electronics Forum | Fri Mar 04 10:04:14 EST 2005 | jbrower
We use Alpha UP-78 (Older paste formula) and it works well for what we do. We standardized our stencils at 5mil with a 10% reduction on IC apetures and a home plate design on passive components. Additionally we use laser cut electro-polished stenci
Industry News | 2018-10-18 10:29:29.0
The Benefits of Embedded Discrete Components
Industry News | 2013-06-20 19:16:54.0
SMTA and Chip Scale Review magazine are pleased to announce the keynote presentation for the 10th Anniversary of the International Wafer-Level Packaging Conference, November 5-7, 2013 in San Jose, CA.
Technical Library | 2013-06-27 14:00:27.0
While IC level ESD design and the necessary protection levels are well understood, system ESD protection strategy and design efficiency have only been dealt with in an ad hoc manner. This is most obvious when we realize that a consolidated approach to system level ESD design between system manufacturers and chip suppliers has been rare. This White Paper discusses these issues in the open for the first time, and offers new and relevant insight for the development of efficient system level ESD design.
Technical Library | 2012-12-26 20:18:50.0
①Single side The basic flexible printed circuit board is used of substrate of single side pcb materials and coated coverlay after finishing printed. ②Double sided That is made of substrates of double sided printed circuit board with double surface coated coverlays after finishing printed. ③Single copper foil with double coverlays Single copper foil coated different coverlays with double surface after finishing printed. ④Air gap Laminating two single printed circuit board together with no glue and bare design to meet high flexibility requirements. ⑤Multilayer That is designed for three and above circuit layers by laminating single side printed circuit board or double sided printed circuit board. ⑥COF IC chips and electronic components are installed on the flexible circuit board directly. ⑦Rigid-Flexible PCB Combined to rigid PCB with supporting and flexible PCB with high flexibility.
Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
3D ICs With TSVs - Design Challenges And Requirements 3D ICs With TSVs - Design Challenges And Requirements As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up to 3D ICs
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2685&OB=ASC.html
". Why does the name change depending on the function of the part? By following this convention, if I have an IC and a transistor in identical SOFL packages, they would map to different footprints
Lewis & Clark | https://www.lewis-clark.com/product-category/pick-place/page/2/
Pick & Place Archives - Page 2 of 3 - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal
