Industry Directory | Manufacturer
50K+ sq ft ESD safe plant, O'Hare area,PCB assembly, AeroSpace AS9100, Medical ISO 13485 and ISO 9001 certified, 01005, 0201, uBGA, PoP, QFN, DFN, CSP, QFP, TQFP placements. State-of-the-art equipment. Aluminum PCBA, Large Boards
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
New Equipment | Education/Training
IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a c
PROMEX INDUSTRIES now fills the need for on shore integrated circuit assembly and packaging foundry services for small lots and prototypes through medium volume production. We are committed to providing high quality, quick turnaround semiconductor
Electronics Forum | Tue Sep 05 07:52:15 EDT 2017 | dgaddisatprimepower
Or if anyone has found specific tricks with QFN packages that may have a similar answer for DFN parts.
Electronics Forum | Tue Sep 05 13:47:11 EDT 2017 | bk
There is no reason why your machine shouldn't be able to place that part. What error or errors are you getting when the machine tries to place that 8-dfn package?
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2013-07-24 16:39:34.0
IPC — Association Connecting Electronics Industries® announces that IPC APEX India™ will offer a comprehensive program of both half- and full-day workshops designed to help engineers find solutions to their most pressing concerns in electronics manufacturing.
Technical Library | 2018-12-12 22:20:22.0
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-on-package (PoP) that offers a reduction in overall PCB board area requirements while allowing for increases in functionality. It utilizes standard, readily available device packaging methods in which high-density packaging is achieved by: (1) using standard "packaged" memory devices, (2) using standard 3-dimensional (3-D) interconnect assembly. The stacking approach provides a high level of functional integration in well-established and already functionally tested packages. The stack packages are built from TSOP packages with 48 leads, stacked either 2-high or 4-high, and integrated into a single dual-flat-no-lead (DFN) package.
Technical Library | 2013-07-25 14:02:15.0
Bottom-termination components (BTC), such as QFNs, are becoming more common in PCB assemblies. These components are characterized by hidden solder joints. How are defects on hidden DFN joints detected? Certainly, insufficient solder joints on BTCs cannot be detected by manual visual inspection. Nor can this type of defect be detected by automated optical inspection; the joint is hidden by the component body. Defects such as insufficients are often referred to as "marginal" defects because there is likely enough solder present to make contact between the termination on the bottom-side of the component and the board pad for the component to pass in-circuit and functional test. Should the board be subjected to shock or vibration, however, there is a good chance this solder connection will fracture, leading to an open connection.
ADI New and Original LT4356IDE1#PBF in Stock IC DFN-12 22+ package LT4356IDE1#PBF 38V, 10A DC/DC Module Regulator with Advanced Input and Load Protection TMS5700714APGEQQ1 LQFP-144 TI 22+ MC33079DR2G SOP-14 ON 22+ TPS65217DRSLR VQFN48 CINTY O
Diodes New and Original DMT6018LDR-7 in Stock IC V-DFN3030-8 , 21+ package DMT6018LDR-7 DUAL N CHANNEL ENHANCEMENT MODE MOSFET Today's Hot Deals： AM3871CCYE100 FCBGA-684 TI 14+ STC8F2K64S4-28I LQFP44 STC 21+ L9396 LQFP64 ST 21
AATEC Ltd | https://aatec.ch/srv-tape-material.php
) We design customized pocket tape for any kind of components Home Tape & Reel material Standard components : DDPAK DPAK SOP PLCC QFP QFN TO252 TO263 SO SOS SOT223 SOT23 TSOP SOH SOJ SC70 SC75 LLP MLP BGA QFPH DFN HBGA SQFP VSO Capacitor Resistor Diodes Your partner in modular automation http://aatec.ch
| https://ipcapexexpo.org/ipc-apex-expo-2021-professional-development-courses
| Rochester Institute of Technology PD02: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead
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