Industry Directory: dfn solderability (2)

Taiwan Dry Tech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

SMT Dry Cabinets by Eureka Dry Tech

Industry Directory | Consultant / Service Provider / Manufacturer

Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD,PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.

New SMT Equipment: dfn solderability (8)

FINEPLACER pico rs - High Density SMT Rework Station

FINEPLACER pico rs - High Density SMT Rework Station

New Equipment | Rework & Repair Equipment

FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allo

Finetech

FINEPLACER® matrix rs Semi-automatic SMT Rework Station

FINEPLACER® matrix rs Semi-automatic SMT Rework Station

New Equipment | Rework & Repair Equipment

Future in Advanced Rework. The FINEPLACER® matrix rs is a semi-automatic rework station representing the latest development from Finetech, encompassing the “Built to be Best” philosophy. With a high level of process modularity, the system supports

Finetech

Electronics Forum: dfn solderability (11)

DFN Solder Quality

Electronics Forum | Wed Aug 07 15:58:17 EDT 2024 | SMTA-64386252

Hello. Since a DFN is a BTC component, an end fillet height is not required on IPC 610 since most of these components did not have a wettable surface on the sides. A cross section in a non-touched up sample could be performed to validate the solder

DFN Solder Quality

Electronics Forum | Tue Jul 30 21:04:23 EDT 2024 | SMTA-68146200

Hello. I got an email from a customer who thinks we have a cold solder problem. I doesn't look like it wicked but since there are pads underneath, shouldn't that have bonded?

Industry News: dfn solderability (7)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

Stencil aperture considerations for QFN chips

Industry News | 2018-10-18 08:40:47.0

Stencil aperture considerations for QFN chips

Flason Electronic Co.,limited

Technical Library: dfn solderability (2)

Using Automated 3D X-Ray Inspection to Detect BTC Defects

Technical Library | 2013-07-25 14:02:15.0

Bottom-termination components (BTC), such as QFNs, are becoming more common in PCB assemblies. These components are characterized by hidden solder joints. How are defects on hidden DFN joints detected? Certainly, insufficient solder joints on BTCs cannot be detected by manual visual inspection. Nor can this type of defect be detected by automated optical inspection; the joint is hidden by the component body. Defects such as insufficients are often referred to as "marginal" defects because there is likely enough solder present to make contact between the termination on the bottom-side of the component and the board pad for the component to pass in-circuit and functional test. Should the board be subjected to shock or vibration, however, there is a good chance this solder connection will fracture, leading to an open connection.

Flex (Flextronics International)

Reliability Study of Bottom Terminated Components

Technical Library | 2015-07-14 13:19:10.0

Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.

Flex (Flextronics International)

Videos: dfn solderability (1)

Reworking a BGA with the PDR Focused IR-E3 (inc.BGA vision alignment) Rework Station

Reworking a BGA with the PDR Focused IR-E3 (inc.BGA vision alignment) Rework Station

Videos

This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems

PDR-America

Express Newsletter: dfn solderability (978)


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