Industry Directory | Manufacturer
Design, development, and manufacture of soldering, desoldering, rework systems and tools for the electronics industry.
Here is Piher�s "revolutionary" answer to the majority of Multi-Purpose Control and Rotary Sensor design problems which were un-resolveable until now. The N-15 series offers you full endless rotation, 340� � 10� wide electrical angle, SMD or through-
Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measurement system,
Electronics Forum | Tue Jun 16 14:35:13 EDT 2020 | dwl
for the fiducials, try a donut shape instead of a disc. The HASL solder seems to settle more evenly on a donut than it does on a dic.
Industry News | 2016-03-30 08:12:07.0
Akrometrix today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms.
Industry News | 2011-03-21 13:35:30.0
JEDEC Solid State Technology Association announced a broad spectrum of ongoing standards development work related to 3D-ICs.
Parts & Supplies | Pick and Place/Feeders
BUSHING CUTTER 45744401/43871702 DOWN STOP BUMPER 45284801 TIP DRIVER J/W LEFT 43077104 BLADE SHEAR LEFT STD 45592701 BLADE SHEAR LEFT STD 12521000 BUSHING BALL 12539000 PLATE GUIDE 15308000 SENSOR INDUCTIVE 44460003 DRIVER TIP LEFT
Technical Library | 2008-03-13 13:02:50.0
Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique.
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
- 3 Separate Heater for Lead Free Solder - 3 Points Cooling System - 5 Thermocouple Inputs - 2 Points Component Control Auto Profiling
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(Whatsapp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ item no.:PSE-KRT02012 lead time:2-3 days product orgin:USA brand: Ungrouped shipping port:xiamen pa
Career Center | Chandigarh, India | Engineering,Maintenance,Management,Production,Technical Support
1.Installation of Machines at Customer Workshop / Work area. 2.Provide training to the customer on Machines after Installation. 3.Meticulously Maintaining the AMC contract, spare parts inventory of the all SMT Machines. 4.Ensuring maximum customer s
Comparing techniques for temperature-dependent warpage measurement Comparing Techniques for Temperature-Dependent Warpage Measurement Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
. The QFN component coefficients of thermal expansion (CTE) were measured using Digital Image Correlation (DIC), and the CTE of each PCB was measured using a thermomechanical analyzer (TMA
| http://www.thebranfordgroup.com/DNN3/Auction/DZSF0323.aspx
) Martin Repair BGA Repair Rework Station Denon Instruments DIC Rework SNC100C Solder New (28) 25-Lb Boxes X-Ray / AOI’s: Fein Focus FXS-160.40 X-Ray Phoenix X-Ray Pcbal Analyzer
