mould maker for plastic injection mould and die casting tooling moulds
PCBs, Stamp sheet metal fabrication, Extrusions, Heatsinks, Die-Casting, Plastic Injection, Rubber Keypad, Cable Assemblies, and more from China and Taiwan.
New Equipment | Solder Materials
Kapp Lunar Flux™ is a white paste for the high temperature soldering of Aluminum and Zinc die cast alloy. It is a reaction-type flux with 70% active ingredients dispersed in alcohol. Kapp Lunar Flux™ has considerable shelf life stability, as the susp
New Equipment | Solder Materials
Kapp Alumite fluxless Aluminum soldering & brazing rod for the fabrication, maintenance and repair of cast Aluminum and Zinc alloys. Alumite has been used and endorsed by leading cast Aluminum, diecast and white metal manufacturers for over 60 years!
Electronics Forum | Sat Sep 20 11:24:27 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - volume of solder paste ? - Clean or not Clean so
Electronics Forum | Sat Sep 20 11:44:39 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - PCB copper finisch ? (OSP,HASL, ENIG, etc) - v
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Used SMT Equipment | Assembly Accessories
Panasonic's BM231 modular high speed multi-functional placement machine boasts any volume, any mix capability by placing a wide array of components from 0402 (01005) microchips to BGA's, CSP's and connectors. Outstanding productivity is a
Used SMT Equipment | Chipshooters / Chip Mounters
BM231 NM-MF13 Panasonic placement machine BM231 parameter: Speed: 0.25S, Loading racks: 60 (double-tape racks 120) pallet 80 stations Component type: 0603-55mm Power supply: 3P/200V/8, Dimensions: 1950/2060/1500mm Weight: 2000kg Suitable c
Industry News | 2013-01-28 02:11:23.0
Offers precise, repeatable dispensing of phosphor for coating and encapsulation
Industry News | 2021-03-04 13:48:24.0
AMFAS Metal Casting Processes include Die Casting, Investment Casting and Sand Casting Capabilities
http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/138.html ??????????? ???????? ????/?????? ???????? ???? ??????/??????????? ????/PCB Punch depanel machines
http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/138.html ??????????? ???????? ????/?????? ???????? ???? ??????/??????????? ????/PCB Punch depanel machines
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pure resin, thermosetting polyimide pure resin 2. Polyimide PI molding methods include: high temperature curing, compression molding, dipping, spraying, calendering, injection molding, extrusion, die-casting, coating Laminating, casting, lamination, foaming, transfer molding, compression molding
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
(solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2
