Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
ORION provides innovative solutions to our customers' EMI/RFI Shielding, Insulating, Screening and Sealing needs in a broad spectrum of manufacturing environments.
Industry Directory | Manufacturer
Manufacturer of automated production systems;PCB magazine loader,PCB separator,PCB cutting machine,PCB unloaders, PCB conveyors,PCB depaneling machines,PCB turn conveyors,PCB conformal coaters,PCB solder paste printer,PCB buffer
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Through the process of CNC routing, we are able to cut with precision electronic insulation products including thicker gauge materials. We also process composite materials such as G-10, FR4 and other materials that are not easily die cut.
Electronics Forum | Tue Jul 24 17:54:14 EDT 2012 | tombstonesmt
Anyone placing any type of masking material die cuts with SMT equipment? We currently manually place a enormous amount of polymide 1/4 inch dots. Looking into automating this process. We already place 2d labels so doesn't seem to far fetched. Any sug
Electronics Forum | Thu Apr 16 08:07:05 EDT 1998 | Stan
Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare die.
Used SMT Equipment | SMT Equipment
Product name: YS100 high speed universal module chip mounter Product number: YS100 Products in detail The characteristics of 25000 CPH (equivalent to 0.14 seconds/CHIP: best conditions) ability of high speed SMT All the time, SMT absolute a
Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov
Industry News | 2023-06-12 21:14:11.0
The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Parts & Supplies | Pick and Place/Feeders
I-pulse smt feeder storage cart Product Name: I-pulse smt feeder storage cart Dimensions(mm):800*600*1000 Product Description:40 / Layer, 2 Layers Uses: For placing feeder,feeder preparation in advance,Feeder Turnover store,Increase productivity.
Parts & Supplies | Chipshooters / Chip Mounters
Smt Chip Mounter feeder storage cart for SIEMENS X series machine Product Name: SIEMENS Smt feeder storage cart Dimensions(mm):800*600*11000 Product Description:40 / Layer, 2 Layers Uses: For placing feeder, feeder preparation in advance, Fee
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Mon Jan 29 00:00:00 EST 2024 - Thu Feb 01 00:00:00 EST 2024 | Big Island, Hawaii USA
Pan Pacific Strategic Electronics Symposium
Career Center | Dallas, Texas USA | Management,Production
Skills/Requirements: BS a plus, prefer someone with 8 plus years in production supervision, prefer die cut manufacturing experience, processes, machines, tools, sheet metal and computer literate. Duties/Functions: Meet production schedules for Arling
Career Center | South Plainfield, New Jersey USA | Management,Research and Development,Sales/Marketing
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | Laguna, Calabarzon Philippines | Engineering,Maintenance,Production,Technical Support
Base on my experience more on line sustaining and preventive maintenance in equipment and testing machine for electronics and semicon company Some slight skills in surface grinding,soldering and LAN connection and installation. Can submit report
Career Center | La Crosse, Wisconsin USA | Maintenance,Production,Quality Control,Technical Support
Ability to read,comprehend and troubleshoot ele- ctronic components using blue prints or schema- tics.
in the surface mount manufacturing process for PCBA assem
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/san-abs-process
SAN ABS Process Polymer Processing Systems BKG - EDI Corporate | Global Directory | Languages Division Only All of Nordson Home Products Applications Blown Film Cast Film Compounding Extrusion Coating and Laminating Fiber and Filaments Fluid Coating Foaming Hot Melt Masterbatch Non
Heller Industries Inc. | https://hellerindustries.com/thermal/
Thermal Process Solutions Leader - Heller Home » The Thermal Process Leader Leader in Thermal Process Solutions Focus on Leadership in Thermal Process Solutions for the SMT, Electronics Assembly, Power Device Assembly and Semiconductor Advanced Packaging Industries
