Industry News | 2017-07-27 19:01:34.0
The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.
SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
: An Exercise in Technically Sound Cost Reduction Bruce M. Misner Abstract 29-3 Evaluation of Reworkable Edge Bond and Corner Bond Adhesives for BGA Applications Fei Xie, Han Wu, Kelley Hodge, Swapan K
