Industry Directory | Manufacturer
Preco, Inc. is a premier system and manufacturing service provider for laser processing, die cutting and screen printing. It also offers reworkable underfill product that can be processed and reflowed under normal surface mount soldering assembly.
Industry Directory | Manufacturer's Representative
Representative company in Singapore/Malaysia/Thailand/Philippines/Indonesia/Vietnam/China
New Equipment | Cable & Wire Harness Equipment
Low Cost Table Top Crimp Machine. The C 200 is a table top low cost crimp tool which takes a variety of dies from different manufacturers. Air operated using standard factory air (5 bar min), with a pressing capacity of up to 1,200 kp, this portable
Low Cost Punch For Singulation Small Tab Routed Panels N200 singulates one tab at a time with upper and lower pinch blades. Singulate curve routed and odd shaped boards. Top and bottom knife set cuts tabs cleanly. Minimal stress on PCB. Toolin
Electronics Forum | Wed Sep 26 14:48:01 EDT 2001 | bobm
there is a company called EFD. my contact there is john kaminski. they have thermocouples that are spring loaded requiring no solder at all. they work great. you attach them to the edge of the board and you can move the end to make contact where you
Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony
I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde
Used SMT Equipment | Soldering - Reflow
There are 2 ovens, one has limitation, so mainly offer for spare andf the other for use in production. HELLER 1913MKIII Reflow Oven 1008Q3F-A8RFS-83960-03 2008.10.15 working "14 zone (13pcs heating and 1 cooling)Water cooling, without chiller CBS
Used SMT Equipment | SMD Placement Machines
ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand： CP40L; CP40LV; CP45F; CP45FV; CP45FVneo); YAMAHA SMT mac
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
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Parts & Supplies | Assembly Accessories
CUTTER RL 131 X02G51112 CUTTER, MOVABLE WPK0312 FIXED GUIDE CUTTER N210081570AA CUTTER DISK 0920H127 WASTE TAPE CUTTER PLATE PN WPK-0271 WPK0271 CUTTER, STATIONART WPK0241 Holes type (Cutter) 536413206 SL
Parts & Supplies | Pick and Place/Feeders
I-pulse smt feeder storage cart Product Name: I-pulse smt feeder storage cart Dimensions(mm):800*600*1000 Product Description:40 / Layer, 2 Layers Uses: For placing feeder,feeder preparation in advance,Feeder Turnover store,Increase productivity.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
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Training Courses | ONLINE | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | , New Zealand | Engineering,Production
We require a fully qualified SMT Engineer to take up the challenge of moving our SMT from great to world class as part of our Process Engineering Team. Reporting to the Engineering Manager the ideal candidate will have a proven track record (5 - 10 y
Career Center | Melbourne, Florida USA | Engineering,Research and Development
Harris Corporation (NYSE-HRS) is an international communications equipment company focused on providing product, system, and service solutions that take its customers to the next level. The company provides wireless, broadcast, government, and networ
Career Center | La Crosse, Wisconsin USA | Maintenance,Production,Quality Control,Technical Support
Ability to read,comprehend and troubleshoot ele- ctronic components using blue prints or schema- tics.
Career Center | Noida, India | Maintenance,Management,Production
Over 12 years of experience in Assembly Line Production, PCB, SMT, Process Improvements, testing & troubleshooting, time and motion study, Value– Engineering as well as Quality in varied industries.
SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
| https://productronica.com/de/messe/presse/pressemitteilungen/detail/die-gewinner-stehen-fest.html
“: SMT Maschinen- und Vertriebs GmbH & Co. KG Christian Ulzhöfer, Geschäftsleitung, SMT Maschinen Vertriebs GmbH & Co. KG: „Unsere Motivation, Reflow-Anlagen zu entwickeln und zu bauen, ist es, dem Kunden die einfachste Lösung zu bieten
| http://etasmt.com/cc?ID=te_news_industry,24361&url=_print
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