95 die pry results

New SMT Equipment: die pry (1)

GE BENTLY NEVADA 126615-01 MODULE PROXIMITOR

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XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: die pry (3)

BGA opens

Electronics Forum | Tue Nov 10 07:35:04 EST 2009 | scottp

Step 1 is to find out what kind of opens you're getting through a cross-section or die & pry. Are they head in pillow, brittle fracture at the intermetallic, bulk solder cracks, ball separation from interposer? Without some basic failure analysis a

BGA Placement Process

Electronics Forum | Wed Mar 31 09:44:12 EDT 2010 | bandjwet

One thing I would suggest right off the top is to go to a paste printing process. This will get first pass yields higher (usually 10+% higher than gel flux). If you are suggesting that you have good collapse everywhere, the profile is adequate (soun

3 Questions & Answers

Express Newsletter: die pry (91)

Technical Considerations for Controlling ESD in Electronics Manufacturing

SMTnet Express - May 8, 2014

SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics

91 Express Newsletter Results