Industry Directory | Consultant / Service Provider
DCD is a leading IP Core provider and SoC design house. The company was founded in 1999 and since the early beginning is considered as an expert in IP Cores architecture improvements.
New Equipment | Board Handling - Storage
A vacuum wand is a tool for gripping and holding a delicate miniature object securely without touching it with your hand. (cannot inhale like a vacuum cleaner!!) This means the object is not damaged. A vacuum pump connected to the wand body provides
The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-
Electronics Forum | Fri Apr 17 14:08:44 EDT 1998 | Earl Moon
| Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else | have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare
Electronics Forum | Wed Aug 28 10:16:12 EDT 2002 | Jim M.
Sam We install a lot of die in the SMT room using same process as SMT parts.Water soluble solder paste is used for attachment of die to ceramic and boards. Biggest problem i found is the adjustment from installing the die in the bonding area. The t
Industry News | 2021-07-15 03:55:39.0
The latest fixtureless technology available for production and validation testing the most challenging Probe Cards
Industry News | 2012-03-15 09:55:33.0
Carlsbad, CA – March 15, 2012: Machine Vision Products (MVP), a leader in Automated Optical Inspection will be demonstrating its Microelectronics AOI systems applications at Semicon China 2012 in Shanghai from March 20 – 22. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 19 years of service to the industry. MVP will be exhibiting with Teltec SemiconductorPacific Limited at Booth #4435.
Career Center | la jolla, California USA | Engineering
More than 18 years experience in AOI. Refer to my resume for more details.
Career Center | Bangalore, Karnataka India | Sales/Marketing
Dear Mam / Sir, Greetings, My 22 years of Sales & Business Development experience in “Capital Equipments” (Plastic processing m/c's, Turn-key packaging m/c’s, etc.) should be of interest to a fast growing company like yours. My experience in vario
SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF9-User-Guide-901-1-07.pdf
cleaner) as it clouds the clear face plate. d. Measure all surfaces for wear and inspect for scratches and gouges. Replace parts if raised material is visible on working plane. e. Lightly stone all surfaces. f. Blow dry all parts. 3. Reassemble die block. a
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
(solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2
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