Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
New Equipment | Test Equipment
https://mechanical-devices.com/portfolio-posts/flextc-temperature-forcing-system/ High-Power Temperature Forcing System Ultimate cooling power 70W@-40⁰C/185W@0⁰C From -65⁰C to +175⁰C / 200⁰C A Hi-tech Breakthrough in Fluid Free Operation • Greates
Industry News | 2022-07-16 08:39:50.0
SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.
Industry News | 2012-04-27 19:07:14.0
Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors (IGBTs) deliver the high switching speeds which are critical for energy efficiency in electric cars, trains and other industrial applications. For the use of alternative energies, ultra-high efficiency and high-power density designs are imperative. Recognizing these market needs, Henkel has developed a comprehensive range of materials to further advance power electronics technology and will showcase these innovations from 8 to 10 May at SMT in Nuremberg.
Three-Dimensional MMIC and Its Evolution to WLCSP Technology Three-Dimensional MMIC and Its Evolution to WLCSP Technology by: Tsuneo TOKUMITSU; Sumitomo Electric Industries, Ltd. The history of multilayered, three-dimensional monolithic microwave
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/3d-packaging-and-wafer-level-packaging
. Wafer-level packages (WLP) are the molded die components with redistribution layers, called wafer level CSP (WLCSP). This is a packaged component base structure
Baja Bid | https://bajabid.com/wp-content/uploads/2023/06/XT-V-130-flyer-EN.pdf
) Wide range of applications Electronic and electrical components Inspection/Detection of broken wedge bonds, lifted ball bonds, wire sweep, die attach, dry joints, bridging/shorts, voiding, etc
