Industry Directory | Equipment Dealer / Broker / Auctions
CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC, Datacon), Kulicke & Soffa, Hesse & Knipps, F&K Delvotec, Orthodyne, ASM, Dage and others. CMTec delivers 'turn-key' projects worldwide.
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
New Equipment | Test Equipment - Bond Testers
For Wire and Die Testing on Royce and Dage tester
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
Electronics Forum | Mon Dec 04 03:40:43 EST 2000 | jmlasserre
Hello, When we discover the broken caps, there are missing and we can observe only either the 2 terminaisons or a small part of ceramic. The defect is due to a shock during the process but it's possible that the caps are fragilized during an operati
Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand
Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.
Used SMT Equipment | Semiconductor & Solar
Bondtester by DAGE, in good condition. DAGE Series 4000 Bondtester product information. The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull
Used SMT Equipment | Semiconductor & Solar
Ball/Die Shear and Wire Pull Measurment with BS250 and DS100 and WP100 Load Cartridges
Industry News | 2014-05-22 15:42:29.0
Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.
Industry News | 2014-06-03 13:04:15.0
The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.
Parts & Supplies | THT Equipment
PCB MMINT 44024101 THETA MOTOR ASSY 47598202 THETA ENCODER ASSY 47509501 Z MOTOR ASSY 47598201 THETA ENCODER ASSY 44714001 CLUCTH UNITIZED 1.5 49752106/50121207 CLUTCH ASSY 45762701 MIRROR CLUCTH FJ 50121208 MIRROR CLUCTH FJ 50151806 CAP 42342901 HD
Parts & Supplies | SMD Placement Machines
PANASERT / UNIVERSAL / DYNAPERT PARTS FOR SALE N434UQ04041 Tube BLKE01252 FUSE 5A 40833025 FUSE 1.5A 42453904 FUSE 5A 42453907 FUSE 1A 46347803 Relay 40525301 SHOCK ABSORBER KXF0DSSAA00 46849802 SENSOR 46347803 RELAY 47323702 PROX SWITCH PNP N
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
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Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/keynotes.cfm
) such as relaxation layer and under-bump metallurgy (UBM)-free WLCSP, and (3) FOWLP (fan-out wafer-level packaging) such as chip-first with die face-down, chip-first with die face-up, and chip-last or redistribution layer (RDL
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/category/ai-spare-parts-1111/page/219?order=name+desc
SMT parts Products AI SPARE PARTS Public Pricelist Public Pricelist Blade, Shear L ¥ 0.00 0.0 CNY Blade Shear Std LH ¥ 0.00 0.0 CNY Blade For N clinch Radial TDK ¥ 0.00 0.0 CNY Blade ¥ 0.00 0.0 CNY Bending tie ¥ 0.00 0.0 CNY Bending tie ¥ 0.00
