Industry Directory | Manufacturer
UV cure one component adhesives. Glass to glass bonding with high temperature autoclave UV adhesive; bridging power ICs to heat sinks with thermally conductive adhesive, balancing high speed motors or reflective wheels, repair of medical devices
RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability. RO3000 serie
280°C). Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required. RO4003C was designed with a dielectric constant of 3.38. The RO4350B has a dielectric constant of 3.48 and is UL94V-0 rated. RO445
Electronics Forum | Wed Dec 13 20:42:57 EST 2000 | Dave F
Material Dk @ 1GHz tan d @ 1GHz Difunctional 4.40 0.020 Multifunctional 4.43 0.018 Polyimide 4.06 0.006 Cyanate ester 3.65 0.005 Bismaleimide triazine 2.94 0.011 PPO-epoxy 3.85 0.012 PTFE-glass 2.60 0.001 PTFE-mat-CE 2.79 0.003 PTFE-ceramic 4.06 0.00
Electronics Forum | Wed Mar 03 20:20:30 EST 1999 | Earl Moon
| We have recently had problems with bare boards coming in too thick. I would like to know how to properly specify the minimum and maximum thickness using the 13949F and IPC 4101 specs. (We currently use "MATERIAL: GFN 0620 C1/C1 A2A per MIL - P - 13
Industry News | 2002-04-04 07:43:27.0
The Companies Will Develop and Produce Substrate Materials for High-speed Applications
Industry News | 2012-06-01 13:55:57.0
As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges
Parts & Supplies | Circuit Board Assembly Products
1) Woven Glass-Reinforced PTFE 2) Single side/Double sided, 3) Dielectric constant Er:= 2.55, 2.65, 2.75, 2.90, 3.0, 3.5 4) Copper weight: 0.5 - 3 oz 5) PCB thickness: 0.17-3.0mm 6) Track/space: per drawing 7) Finish: Copper finish.
Technical Library | 2018-11-07 20:48:01.0
Glass offers a number of advantages as a dielectric material, such as a low coefficient of thermal expansion (CTE), high dimensional stability, high thermal conductivity and suitable dielectric constant. These properties make glass an ideal candidate for, among other things, package substrate and high-frequency PCB applications. We report here a novel process for the production of printed circuit boards and integrated circuit packaging using glass as both a dielectric medium and a platform for wiring simultaneously.
Technical Library | 2014-08-14 17:58:41.0
High reliability applications for high performance computing, military, medical and industrial applications are driving electronics packaging advancements toward increased functionality with decreasing degrees of size, weight and power (SWaP) The substrate technology selected for the electronics package is a key enabling technology towards achieving SWaP. Standard printed circuit boards (PWBs) utilize dielectric materials containing glass cloth, which can limit circuit density and performance, as well as inhibit the ability to achieve reliable assemblies with bare semiconductor die components. Ceramic substrates often used in lieu of PWBs for chip packaging have disadvantages of weight, marginal electrical performance and reliability as compared to organic technologies. Alternative materials including thin, particle-containing organic substrates, liquid crystal polymer (LCP) and microflex enable SWaP, while overcoming the limitations of PWBs and ceramic. This paper will discuss the use of these alternative organic substrate materials to achieve extreme electronics miniaturization with outstanding electrical performance and high reliability. The effect of substrate type on chip-package interaction and resulting reliability will be discussed. Microflex assemblies to achieve extreme miniaturization and atypical form factors driven by implantable and in vivo medical applications are also shown.
SMTnet Express, November 8, 2018, Subscribers: 31,451, Companies: 25,347, Users: 25,378 Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards Joel Schrauben, Cameron Tribe
PERFORMANCE by Earl Moon Again, the 7628 glass st
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/thermal-compound-glossary
) has the minimum thermal resistance. Thermal resistance will not change at thickness less than this value. C D Dielectric Constant A measure of a substance's ability to insulate charges from each other
ORION Industries | http://orionindustries.com/pdfs/nomex410.pdf
Nomex Type 410 risk of partial discharges (corona). The Full Wave Impulse dielectric strength data of Table I were generated on flat sheets, such as in layer and barrier applications
