Industry Directory: different package problem (54)

UNISOFT Corporation

UNISOFT Corporation

Industry Directory | Consultant / Service Provider

PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..

New SMT Equipment: different package problem (89)

Peel Back Force Tester (PBFT)

Peel Back Force Tester (PBFT)

New Equipment | Pick & Place

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

Unisoft ProntoAOI - AOI Machines Programming Software

Unisoft ProntoAOI - AOI Machines Programming Software

New Equipment | Software

ProntoAOI is used by electronic manufacturers to quickly program their Automatic Optical Inspection (AOI) machines and X-RAY Equipment. ProntoAOI programs most popular AOI Equipment such as YESTech, Mirtec, Orbotech, Agilent, Omron, CyberOptics, Vi

UNISOFT Corporation

Electronics Forum: different package problem (2465)

Components placement with different package

Electronics Forum | Tue Jul 13 11:21:28 EDT 2021 | stephendo

You may have to use an adaptor board. A small board with one footprint on one side and the other on the other side. Do not assume that the pin outs of the two parts are the same. I have seen smaller parts with a different pin out than the bigger part

Components placement with different package

Electronics Forum | Tue Jul 13 19:20:51 EDT 2021 | emeto

Just give them triple the price and they will love to make re-design. If you do what was suggested with the additional PCB, price might be close enough to triple.

Used SMT Equipment: different package problem (69)

Yamaha Refurbished YAMAHA YV100XG SMT Pick and Place Machine

Yamaha Refurbished YAMAHA YV100XG SMT Pick and Place Machine

Used SMT Equipment | Pick and Place/Feeders

Refurbished YAMAHA YV100XG SMT Pick and Place Machine Machine Type YV100XG Substrate size M type  L460 * W335 (MAX) -L50 * W50 (MIN)   L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute accuracy (μ + 3σ): ± 0

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Panasonic  NPM module

Panasonic NPM module

Used SMT Equipment | SMT Equipment

Product Name :Panasoinc  NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: different package problem (1187)

SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

SMTnet

Low-Cost UNIX- and PC-Based Boundary-Scan Upgrade for Agilent 3070 In-Circuit Testers

Industry News | 2003-04-03 08:51:07.0

Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming

SMTnet

Parts & Supplies: different package problem (111)

Juki Help customer solve problems of 750L machine

Juki Help customer solve problems of 750L machine

Parts & Supplies | Pick and Place/Feeders

Help customer solve problems of 750L machine May because of I'm in this area more than 4 years, I have some new feelings when my customers come across a problem. A Spain customer purchase a used JUKI 750L machine from another customer of mine

ZK Electronic Technology Co., Limited

Panasonic CM202,CM402,CM602 115AS NOZZLE N610017372AC

Panasonic CM202,CM402,CM602 115AS NOZZLE N610017372AC

Parts & Supplies | Component Packaging

PANASONIC CM202, CM402, CM602 115AS NOZZLE N610017372AC My friends, we have a Panasonic CM202, CM402, CM602 nozzle, we need to welcome to contact me, we have a series of different models of Panasonic nozzle zoey@jinchensmt.com

Jinchen Electric Technology Co,.Ltd

Technical Library: different package problem (55)

THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY

Technical Library | 2023-01-17 17:19:44.0

A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.

Heller Industries Inc.

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Technical Library | 2023-01-17 17:58:36.0

Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.

Heller Industries Inc.

Videos: different package problem (701)

Peel Back Tester

Peel Back Tester

Videos

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

Example of how to import CAD data and BOM files, and export to an AOI machine program setup file.

Example of how to import CAD data and BOM files, and export to an AOI machine program setup file.

Videos

www.unisoft-cim.com/prontoaoi.htm - ProntoAOI software from Unisoft is used by electronic manufacturers to quickly program their Automatic Optical Inspection (AOI) machines and X-RAY Equipment. ProntoAOI programs most popular AOI Equipment such as

UNISOFT Corporation

Training Courses: different package problem (88)

Counterfeit Component Prevention Training Course

Training Courses | | | Other Courses

Other courses related to electronics manufacturing and assembly

Blackfox Training Institute, LLC

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

Events Calendar: different package problem (17)

Post – Moore's Law Electronics: From Now until Quantum Computing

Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,

Post – Moore's Law Electronics: From Now until Quantum Computing

Surface Mount Technology Association (SMTA)

Symposium on Counterfeit Parts and Materials

Events Calendar | Tue Jun 23 00:00:00 EDT 2020 - Thu Jun 25 00:00:00 EDT 2020 | College Park, Maryland USA

Symposium on Counterfeit Parts and Materials

Surface Mount Technology Association (SMTA)

Career Center - Jobs: different package problem (69)

Advanced Packaging Engineer

Career Center | San Jose, California USA | Engineering,Research and Development

Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for

F-O-R-T-U-N-E Personnel Consultants of Huntsville

Manufacturing Engineer

Career Center | , Florida USA | Engineering,Production

� Will develop, implement, and maintain PCB assembly processes including screen printing, placement, reflow, and automated optical inspection. � Will work with quality, design, and test on DFx and NPI. � Identify opportunities and drive implementati

F-O-R-T-U-N-E Personnel Consultants of Huntsville

Career Center - Resumes: different package problem (68)

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Express Newsletter: different package problem (777)

Partner Websites: different package problem (2349)

CF8 Documentation Package

GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf

CF8 Documentation Package Documentation Package for CF-8 Axial Component Lead Former PN 801-1-01 version 2.0 03/22/2021 CONTENTS of CF-8 Documentation Package Operating Guide In addition to installation, set up, and operating procedures, this guide includes electrical schematics and maintenance

GPD Global

Different tolerances - PCB Libraries Forum - Page 2

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/different-tolerances_topic1618&OB=DESC_page2.html

Different tolerances - PCB Libraries Forum - Page 2   Forum Home > PCB Footprint Expert > Questions & Answers    New Posts    FAQ    Search    Events    Register    Login Different tolerances

PCB Libraries, Inc.


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