Linseis manufactures and distributes Thermal Analysis instruments that include Dilatometers,Thermal Analyzers(DTA,TGA)Differential Scanning Calorimeters,Chart Recorders,Circular recorders,Dataloggers,Psychrometers,Digital Thermometers
In the recent years, PXI has established its position in the test and measurement industry, especially with such features as high data transfer rates, small rugged industrial footprint, open standard and multiple vendors. PXI (PCI eXtensions for Inst
A digital combo set. Available in four modifications. A digital combo set for maintenance and repair of carrier channels and data transmission equipment of information structures. Functions Sine-wave generator Broadband rms voltmeter Narro
Electronics Forum | Wed Mar 18 09:03:57 EST 1998 | Earl Moon
| Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago | that deals with this exact subject. Best way to deal with this is to use a ce
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Used SMT Equipment | General Purpose Test & Measurement
86122C Main features Absolute wavelength accuracy: ± 0.2 ppm Differential wavelength accuracy: ± 0.15 ppm Wavelength scan of less than 0.5 seconds Wavelength scan of less than 0.3 seconds with fast update optionPrice: $95000Price vary with opti
Used SMT Equipment | General Purpose Test & Measurement
86122C Main features Absolute wavelength accuracy: ± 0.2 ppm Differential wavelength accuracy: ± 0.15 ppm Wavelength scan of less than 0.5 seconds Wavelength scan of less than 0.3 seconds with fast update optionPrice: $95000Price vary with opti
Industry News | 2008-05-18 02:32:03.0
Richardson, TX (May 13, 2008) - ASSET InterTech (www.asset-intertech.com), the leading supplier of open tools for embedded instrumentation, has joined the Mentor Graphics OpenDoor Program in order to ensure toolset interoperability for embedded instrumentation applications. Through the program ASSET and Mentor will enable the exchange of data between Mentor's chip-level inserted design-for-test (DFT) structures, such as the JTAG infrastructure, and ASSET's ScanWorks platform, which automates, accesses and analyzes embedded instrumentation and DFT data.
Industry News | 2013-10-24 16:29:45.0
Acculogic GmbH will showcase the new FLS980 Series III Flying Probe System in Hall A1, Stand 465 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Technical Library | 2022-12-05 16:28:06.0
The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.
Technical Library | 2024-09-02 17:01:54.0
A printed circuit board (PCB) is an integral component of any electronic product and is among the most challenging components to recycle. While PCB manufacturing processes undergo generations of innovation and advancement with 21st century technologies, the recycling of PCBs primarily employs 1920's shredding and separation technologies. There is a critical need for alternative PCB recycling routes to satisfy the increasing environmental demands. Previous work has developed an environmentally benign supercritical fluid process that successfully delaminated the PCB substrates and separated the PCB layers. While this work was successful in delamination of the PCB substrates, further understanding is needed to maximize the interactions between the supercritical fluid and PCB for an optimal processing scenario. As such, this research presents an exploratory study to further investigate the supercritical fluid PCB recycling process by using supercritical carbon dioxide and an additional amount of water to delaminate PCB substrates. The focus of this study is to test delamination success at low temperature and pressure supercritical conditions in comparison to the previous studies. Furthermore, material characterization methods, such as differential scanning calorimetry, dynamic mechanical analysis, and Fourier transform infrared spectroscopy, are included to study the delaminating mechanisms. Results from the recycling process testing showed that the PCB substrates delaminated easily and could be further separated into copper foils, glass fibers and polymers. Surprisingly, the material characterization suggested that there were no significant changes in glass transition temperature, crosslink density, and FTIR spectra of the PCBs before and after the supercritical fluid process.
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ Manufacturer Rockwell Automation Module Type Analog Input module Series ControlLogix Part N
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ Manufacturer Rockwell Automation Resolution 16-21 Bits Module Type Analog Input module with HA
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
SMTnet Express February 14, 2013, Subscribers: 26181, Members: Companies: 13288, Users: 34310 Boundary Scan Advanced Diagnostic Methods Boundary-scan (1149.1) technology was originally developed to provide a far easier method to perform digital DC
Building Differentiated Products Through Shorter, More Predictable Design Cycles Building Differentiated Products Through Shorter, More Predictable Design Cycles With the recent global economic slowdown, system companies are facing shrinking
GPD Global | https://www.gpd-global.com/co_website/pdf/coating/SimpleCoat-Operation-Guide-23100600.pdf
.................................................................................................................................. 7 2.1. Pressure differential switch setup .................................................................................................. 9 2.2. Calibrating heads ........................................................................................................................... 9 3. Installing software
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Indium metal provides a high thermal conductivity junction (k~86 W/m-K) between the die and lid. Unlike other solid metals, indium is compliant enough to conform to movement between the die and lid from differential thermal expansion strains
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