Industry Directory: difficulty filling thru holes with solder (1)

PCB Express Builds

Industry Directory |

A quality pcb assembly contractor, small to large orders filled at reasonable prices , thru hole soldering and rework , or pcb modifications and repairs. loading and inspection.

New SMT Equipment: difficulty filling thru holes with solder (3)

GW-10A-HT Soldering Fountain with Blow-Thru Air Nozzle

GW-10A-HT Soldering Fountain with Blow-Thru Air Nozzle

New Equipment | Wave Soldering

High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards.  Microprocessor based digital controller that regulates solder temperature

DDM Novastar Inc

MBT 301 Soldering & Desoldering Station with TD-100 & SX-100

MBT 301 Soldering & Desoldering Station with TD-100 & SX-100

New Equipment | Soldering - Other

Soldering, Desoldering, Rework & Repair of Through-Hole/Surface Mount PCB's PACE's MBT 301 is a self contained, 2 channel rework station that offers high capacity, low temperature SMT/Thru-Hole soldering, desoldering and repair. The unit features 2

PACE Worldwide

Electronics Forum: difficulty filling thru holes with solder (61)

Re: flow thru

Electronics Forum | Tue Nov 02 17:52:17 EST 1999 | Dave F

Jim: Several points: 1 If you�re correct about corrosion of your component leads (which is entirely possible if the leads are steel, as you say), then the AIM 264-5 no-clean may not be aggressive enough to remove the corrosion you are seeing routin

Using solder paste/reflow for leaded thru hole parts .

Electronics Forum | Wed Jul 01 11:33:30 EDT 1998 | Upinder Singh

Hi all. I am trying to put one 20 pin thru hole connector along with the smt components on the PCB. I would appreciate if somebody can guide me in getting thru this process. I also need to know how much bigger the holes on the screen or stencil shou

Industry News: difficulty filling thru holes with solder (21)

Revive Your Dispenser with Advanced Dispense Technologies

Industry News | 2016-12-09 23:33:42.0

GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.

GPD Global

GPD Global's PCD Technology Is Proven Compatible with Silver-filled Electrical and Thermal Epoxies

Industry News | 2010-12-07 14:53:07.0

GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.

GPD Global

Technical Library: difficulty filling thru holes with solder (2)

Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution

Technical Library | 2019-07-17 17:56:34.0

The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface. In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented.

MacDermid Inc.

ACHIEVING EXCELLENT VERTICAL HOLE FILL ON THERMALLY CHALLENGING BOARDS USING SELECTIVE SOLDERING

Technical Library | 2023-11-14 19:52:11.0

The continuous drive in the Electronics industry to build new and innovative products has caused competitive design companies to develop assemblies with consolidated PCB designs, decreased physical sizes, and increased performance characteristics. As a result of these new designs, manufacturers of electronics are forced to contend with many challenges. One of the most significant challenges being the processing of thru-hole components on high thermal mass PCBs having the potential to exceed 20 layers in thicknesses and have copper mass contents of over 40oz. High thermal mass PCBs, coupled with the use of mixed technologies, decreased component spacing, and the change from Tin Lead Solder to Lead Free Alloys has lead many manufacturing facilities to purchase advanced soldering equipment to process challenging assemblies with a high degree of repeatability.

Plexus Corporation

Videos: difficulty filling thru holes with solder (1)

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

Videos

http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to

GPD Global

Career Center - Resumes: difficulty filling thru holes with solder (1)

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

Express Newsletter: difficulty filling thru holes with solder (1000)

SMTnet Express - March 3, 2016

SMTnet Express, March 3, 2016, Subscribers: 24,124, Companies: 15,000, Users: 40,059 Nanocopper Based Paste for Solid Copper Via Fill David Ciufo, Sujatha Ramanujan, Janet Heyen, Michael Carmody; Intrinsiq Materials , Sunny Patel; Candor

SMTnet Express - June 19, 2014

SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y

Partner Websites: difficulty filling thru holes with solder (245)

How To Specify Plated Holes? - PCB Libraries Forum - Page 1

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/how-to-specify-plated-holes_topic1400_post5615.html

? I see there is a checkbox that say's "Plated" when I view the pad stack.  The box is checked and greyed-out but my boards came back with unplated holes

PCB Libraries, Inc.

Conformal Coating Machine with Excellent Repeatability

GPD Global | https://www.gpd-global.com/co_website/news-events-pr-531.php

& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER

GPD Global


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