Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
New Equipment | Board Handling - Pallets,Carriers,Fixtures
MB Manufacturing’s Glass Inspection Insert is a heat, shock and chemically resistant borosilicate glass containing 80% silica and 13% boric oxide. It expands very little when heated, so it can withstand great temperature changes without cracking. Th
Electronics Forum | Tue Oct 18 15:50:01 EDT 2022 | smith88
IPC states chips and cracks in glass body are defective if beyond specifications. Chips or cracks in glass body beyond the part specification, see Figure 9-18. • Cracked or damaged glass bead beyond part specification (not shown). On some glass
Electronics Forum | Sun Dec 23 08:41:04 EST 2001 | dwoon
Does anyone has experience in ACF (anisotropic conductive film) process? What is the typical bonding pressure/force/temperature for FCOG (flip chip on glass)? Will the glass crack when a high pressure applied during flip chip placement? Thanks and
Industry News | 2018-12-08 03:27:35.0
Printed Circuit Board (PCB) for Surface Mount Technology (SMT)
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Parts & Supplies | Soldering - Wave
Controller and interface assembly from an ERSA wave solder machine EPROM V2.97 KUHNKE 71.633. 425.120.01 The glass is cracked but the LCD is not cracked. FOB: Origin AssuredTechnicalServiceLLC@Gmail.com
Technical Library | 2022-01-26 15:26:56.0
In this work an attempt is made to improve the fracture toughness and electrical conductivity of epoxy/glass fiber based laminates by the inclusion of carbon nanotube (CNT) fillers. The fiber orientation of the epoxy/ glass fiber (GF) fabric laminates was optimized based on estimation of mechanical properties. The carboxylic acid functionalized CNTs were incorporated into epoxy matrix by ultra-sonication method. The nano filled epoxy resin was used to prepare laminates with 30/45 GF fabric orientation. The CNT content was varied and its effect on the tensile properties was determined. The fracture toughness of multiphase composites was estimated using single edge notch bend (SENB) test. The presence of CNTs improved the fracture toughness by a crack bridging mechanism. The volume resistivity of multiphase composites was found to be superior to the conventional epoxy/CNT composite. The presence of glass fabric reduces the number of inter-tube contacts contributing to the reduction in volume resistivity.
Technical Library | 2021-08-11 01:00:37.0
Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations.
E-mail: Lyric.lin@qy-smt.com Facebook: Lyric Lin Whatsapp: +86 15626851571 Wechat: 15626851571 ML-100 Manual PCB Separator（Hand Push Type） The ML-100 is suitable for a small number of PCB boards to be separated and does not require
Suitable for diversified glass fibre board, FR-4 board, aluminum board, etc, especially for the PCB with components on both sides. If you have any question about the machine, please feel free to contact e-mial : bella@qy-smt.com
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
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