Industry Directory | Manufacturer
Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, g
Welcome to the next generation in PWB test solutions. We combine an exceptional team of technology and applications experts with HIOKI's industry-leading systems to enhance your reliability and to speed up your product development process.
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
New Equipment | Rework & Repair Services
PCB Repair Services BEST is your experienced resource for high value added PCB repair services. If you need any of the following completed to your printed circuit board then let the experts at BEST be your answer: Pad repair services Pad replace
Electronics Forum | Wed Mar 29 22:15:49 EST 2006 | davef
Send me the pix. Is the solder attached well to the pad on the board?
Electronics Forum | Thu Sep 13 18:00:35 EDT 2012 | mark25y2001
possible problem are loading orientation, solder flow cannot reach the pad portion due to trap of the body of the diode... or try to adjust turbulent but observe overflow... because turbulent are penetrate solder to pad and terminal of the diode. ho
Used SMT Equipment | Repair/Rework
Warranty: 90 days parts & labor against manufacturing defects - wear items not included 1IR550A000A67 1 PC IR550A Infrared Rework System - 115V/US 1600 W heating power -800 W bottom side - 135 x 260 mm -800 W top side - 60 x 60 mm 1 K-type themoco
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our MVP Machine Vision Products AOI Machines For Sale. We have a total of (4) MVP Automated Optical Inspection Machines and (2) Inspection Repair Stations.. They were taken off line due to company closer. All
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Parts & Supplies | Assembly Accessories
Samsung CP Feeder; CP8 * 2MM CP8 * 4MM CP12 MM CP16 MM CP24 MM CP32 MM CP44 MM CP56 MM Samsung CP Feeder Accessories; Feed gear, pressure cover, lock buckle, connecting rod, push rod, spacing screw, beak, one-way bearing, roll wheel, spring, etc..
Parts & Supplies | Pick and Place/Feeders
We also supply following Simens Spare parts : 00358497-02 Cable HS50, Comp. Illum.Control, modular 00358644-02 KIT ELECTRIC HEAD CRASH SENSOR 00358653S04 Lifting Table Single transport 00358654S04 Lifting Table Dual transport 0035867
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
03059051-01 Lifting Table Dual Conveyor X4i 03059195-01 Retrofit kit pneumatic unit D1 03059196-01 Gas Spring 400N ( for D1/D2 Left Hood) 03059238S01 Linear Dipping Unit (LDU) Basis 03059375-01 Starter kit filter disc 2-parts / C+
00359433-01 Reflection Light Barrier, configured 00359434-01 Crash Light Barrier,configured 00359435-01 Neutral Position Light Barrier 00359436-01 Unlock Device WTC 00359438-01 Connection Cable: Power MTC 00359459-01 LIFTING TABLE SINGLE CONVEYO
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/category/yamaha-smt-nozzles-1158/page/3?order=list_price+desc
¥ 0.00 0.0 CNY O-ring ¥ 0.00 0.0 CNY Rubber pad for nozzle 30BA ¥ 0.00 0.0 CNY Sapphire Nozzle 52# ¥ 0.00 0.0 CNY NOZZLE 302A ¥ 0.00 0.0 CNY NOZZLE 65A ¥ 0.00 0.0 CNY YV100II Gripper Nozzle with Rubber Pad
| http://etasmt.com/cc?pageID=newsList&ID=te_news_news,0&pNum=7
. It supplies magazine racks directly to a lift... Show Details Magazine Unloader- All type Located at the final stage of the SMT line, this unit stacks PCBs in an empty magazine rack using a pneumatic pusher one by one
