New SMT Equipment: dip preformer (4)

ACP 120 Anti-Oxidation Solderable Coating

ACP 120 Anti-Oxidation Solderable Coating

New Equipment | Materials

ACP 120 series are an anti-oxidation solderable coatings, which have been designed for anti-corrosion and rusting for metal surfaces such as nickel, steel, aluminum and other metals; solderable surfaces on which solder paste, solder preform or solder

YINCAE Advanced Materials, LLC.

ALPHA® Soldering Alloys

ALPHA® Soldering Alloys

New Equipment | Solder Materials

ALPHA® wave solder and soldering bar metals (wave soldering alloys) offer best value soldering performance – quality solder bar metals products at the lowest cost of ownership, and thanks to a global copy exact product policy, consistency of wave sol

MacDermid Alpha Electronics Solutions

Electronics Forum: dip preformer (3)

BGA rework equipment - suggestions?

Electronics Forum | Tue Aug 05 11:32:53 EDT 2014 | hegemon

SFC and PhilC To answer one open question, and I too have difficulty with little stencils and preforms..... If you can manage, try dipping your balls in paste. It adds the right amount of flux and a bit of metal as well. We have a nice Rework Stat

Looking for a DIP lead part-prep tool

Electronics Forum | Fri Mar 08 08:57:19 EST 2019 | sumote

spoiltforchoice, Have you used this device? If you have, how does it preform as compared to the original tool I am looking for? Thank you,

Industry News: dip preformer (32)

SHENMAO Features LED Die Bonding Solder Pastes at IPC APEX 2016

Industry News | 2016-03-10 18:40:47.0

SHENMAO proudly announces a series of Lead-free LED Die Bonding Solder Pastes made locally in the USA and with the same quality in 8 other worldwide locations for various Die Bonding processes. Powder Size is available from T3 to T8.

Shenmao Technology Inc.

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Industry News | 2017-06-25 20:33:39.0

SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.

Shenmao Technology Inc.

Videos: dip preformer (1)

ALPHA® Preforms with solder paste adds solder volume.

ALPHA® Preforms with solder paste adds solder volume.

Videos

ALPHA® Preforms with solder paste adds solder volume.

MacDermid Alpha Electronics Solutions

Express Newsletter: dip preformer (46)

Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO


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