Industry Directory: dip soic (4)

Advanced Interconnections Corporation

Industry Directory | Manufacturer

ISO 9001 Certified Designer and Manufacturer of Innovative Interconnect Solutions for Electronic App

Logical Systems Corp

Industry Directory |

Logical Systems designs and manufactures adapters for EPROM programming, prototyping and production. Off the shelf and custom solutions available.

New SMT Equipment: dip soic (13)

IPC J-STD-001 Rev G Solder Training Kit

IPC J-STD-001 Rev G Solder Training Kit

New Equipment | Education/Training

BEST IPC J-STD-001 training kits feature REAL circuit boards that represent actual soldering conditions. This kit features "062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This training ki

BEST Inc.

J-STD-001 Training Kit for Revision F

J-STD-001 Training Kit for Revision F

New Equipment | Education/Training

BEST IPC J-STD-001 Revision F training kits feature REAL circuit boards that represent actual soldering conditions. This kit features "062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This

BEST Inc.

Electronics Forum: dip soic (9)

Re: lead straightening

Electronics Forum | Wed Feb 17 09:38:25 EST 1999 | Jesse Smith

We have machines here that refurbish SOJs, DIPS, PGAs, TSOPs, SOICs, and most QFP. for detailed information call Jesse Smith 800-950-3344 ext 1837

QFP Coplanarity & Alloy 42

Electronics Forum | Tue Sep 30 21:00:41 EDT 2003 | davef

We're not clear on what you seek. So, as a starting point for our discussion, we wouldn't get agitated if we saw "routine" coplanarity of 4 thou. For instance: Maximum Lead Coplanarity [Altera] Package||Acronym||Lead material||Finish||Maximum Lead

Industry News: dip soic (7)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

NEW ARIES SHORTFORM CATALOG COVERS PIN BALL BGA

Industry News | 2004-11-10 18:04:10.0

Frenchtown, NJ, November 2004

Aries Electronics Inc

Videos: dip soic (109)

IPC J-STD-001 Rev. F Solder Training Kit

IPC J-STD-001 Rev. F Solder Training Kit

Videos

BEST IPC J-STD-001 Revision F training kits feature REAL circuit boards that represent actual soldering conditions. This kit features "062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This

BEST Inc.

EyePoint P10 promo

EyePoint P10 promo

Videos

Overview of EyePoint P10 system

Engineering Physics Center of MSU

Training Courses: dip soic (2)

IPC-7711/7721 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-7711/7721 Specialist (CIS)

The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.

Circuit Technology Inc.

IPC-7711/7721 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-7711/7721 Trainer (CIT)

The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.

Circuit Technology Inc.

Express Newsletter: dip soic (37)

Partner Websites: dip soic (13)

IC Programming System: A Deep Dive into the Core of Electronics Manufacturing - I.C.T SMT Machine

| https://www.smtfactory.com/ic-programming-system.html

& Place Machine JUKI Pick & Place Machine YAMAHA Pick & Place Machine PANASONIC Pick & Place Machine FUJI Pick & Place Machine I.C.T Pick & Place Machine SMT Peripherals DIP Machine Acrab Series W Series Automatic Insertion Machine Selective Wave Soldering Machine DIP Peripheral Equipment PCB Handling Machine Loaders

AB59829 MY300SX Specification May 2017.indd

Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf

– MIDAS Component range Chip (from 01005), SOIC, PLCC, TSOP, QFP, BGA, flip chip, odd- shape, surface-mount connectors, through-hole components, CSP, CCGA, DPAK, Alcap, Tantalum Component specification Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005) Max: 140 x 73 x 15 mm (5.51” x 2.87” x 0.59”) (1) Max: component weight: 140 g (2) (1) With 4K vision

Baja Bid


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