Industry Directory | Consultant / Service Provider
Service + Maintenance and Providing spare parts/ machines - all from one hand- Siemens ASM Siplace/Ekra/DEK/ASYS/Rehm/Seho
Nutzentrennmaschine/Nutzentrenner ASCEN-620 NSL zum Trennen von Aluminium Leiterplatten/FR4 www.ascen.us Seit mehr als 10 Jahren werden unsere Nutzentrennmaschinen kontinuierlich weiterentwickelt und verbessert, um spannung
Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno
Electronics Forum | Fri Feb 16 09:30:38 EST 2007 | DEK Answer Guy
Hello PR, PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of
Electronics Forum | Mon Feb 12 21:38:38 EST 2007 | DEK Answer Guy (PR Dept)
Technical Papers) -ProFlow� upgrades (MPU's). -Paste Low Optimisation -Adjustment of the Print Carriage to ensure Squareness to the Stencil -Replacement of Hinge Pin Assembly -Conversion of ProFlow� to Horizontal Mount -ProFlow� Guides for Operators
Used SMT Equipment | Chipshooters / Chip Mounters
Siplace 80 F4 Modul Bj. 2001 links-rechts Einfachtransport 12er Collect+Place-Kopf + IC-Kopf Auf Wunsch mit Steuerungsrechner SiplacePro 5.2 guter Zustand - direkt aus der Fertigung auf Wunsch komplett überholt mit neuen Antriebsriemen
Industry News | 2006-04-17 18:17:31.0
DEK has won another prestigious industry award for its revolutionary ProFlow� DirEKt Imaging technology. At the Nepcon China 2006 exhibition in Shanghai, China, DEK will receive the award for best entry in the Dispensing Systems/Equipment category at the Electronics Manufacturing Asia Innovation Awards 2006.
Industry News | 2009-08-19 13:06:06.0
Extending its capabilities for placing solder spheres at high speed, DEK’s proven DirEKt Ball Placement™ process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield of over 99.99%, DirEKt Ball Placement delivers the speeds necessary for modern package manufacture without sacrificing anything in the way of performance.
http://www.pcb-separator.com/ Nutzentrennmaschine/Nutzentrenner/PCB depaneling machine ASCEN-620 NSL zum Trennen von Aluminium Leiterplatten/FR4
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/industrial-coating-systems/products/accessories-kits-and-auxiliary-equipment/nlighten-led-kit
. Präzise beschichten. Sicher kontrollieren. Sehen Sie Ihre Pulverbeschichtung im richtigen Licht. Encore nLighten™* LED Kit – direkt an der Encore Pulverpistole angebracht, leuchtet das leistungsstarke LED Licht den zu beschichtenden Bereich optimal aus
.gif)
