Electronics Forum: disadvantage of using ipa (24)

Disadvantages of using the ultrasonic cleaners - PCB cleaning

Electronics Forum | Fri Aug 22 00:11:16 EDT 2008 | rameshr

Hai, I wish to know the advantages & disadvatages of using the Ultrasonic cleaners for cleaning the assembled pcb. Can anybody help us.

Disadvantages of using the ultrasonic cleaners - PCB cleaning

Electronics Forum | Fri Aug 22 08:17:18 EDT 2008 | davef

There are several interesting posts in the fine SMTnet Archives. Here's one: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=8594&#Message33876

Industry News: disadvantage of using ipa (5)

Analysis of smt nozzle Material

Industry News | 2018-10-18 09:25:04.0

Analysis of smt nozzle Material

Flason Electronic Co.,limited

AME Academy 2 Presents: The Future of Additively Manufactured Electronics

Industry News | 2021-05-14 05:42:25.0

Nano Dimension Ltd. (Nasdaq: NNDM) announced today that after the successful launch in February, it is back with AME Academy 2! The virtual seminar is scheduled to take place Tuesday, May 18, 2021 from 10 a.m. – 2 p.m. EST.

Nano Dimension

Technical Library: disadvantage of using ipa (2)

Effect of Contact Time on Lead-Free Wave Soldering

Technical Library | 2008-08-28 22:50:11.0

The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave.

Speedline Technologies, Inc.

Effect of Silver in Common Lead-Free Alloys

Technical Library | 2023-01-02 17:50:34.0

Silver bearing alloys have been used in electronics soldering for many years. Silver has been used in tin-lead solders (Sn62Pb36Ag2) to combat silver scavenging from silver plated electronic components as well as to improve thermal fatigue resistance. Many of the common lead-free alloys contain some amount of silver. Silver bearing alloys have good electrical and thermal conductivity as well as the ability to wet to the common surface finishes used in printed wiring assemblies, thus giving it all the attributes needed for an electronic solder alloy. Presence of silver in Sn based solders increases the bulk solder modulus and is generally believed to improve resistance to fatigue from thermal cycles. Increased solder modulus can be advantageous or disadvantageous depending on the desired performance attribute. For example in high strain rate situations, higher modulus of the bulk solders results in lower life time. A wide variety of leaded and lead-free

Cookson Electronics Assembly Materials

Express Newsletter: disadvantage of using ipa (903)

Partner Websites: disadvantage of using ipa (13)

Nitrogen Reflow Oven-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,4161&url=_print

 is easily oxidized, often caused problems that solder wetting angle is too largely exposed and copper pad phenomenon. Although a number of electronics manufacturers for operating costs consideration is not  temporarily using nitrogen, but with the

Guide to a Successful Lead-Free Soldering - Blackfox - Premier Training and Certification

Blackfox Training Institute, LLC | https://www.blackfox.com/blog/guide-to-a-successful-lead-free-soldering/

.  Which alloys and fluxes are suitable for lead free hand soldering ? One disadvantage of lead-free solder is that it is not available in wire form, as some alloys, such as tin bismuth, are difficult to pull into wire. Tin-silver-copper (SAC

Blackfox Training Institute, LLC


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