New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
Electronics Forum | Thu Oct 26 14:51:46 EDT 2000 | eramirez
Currently I am running a very dense PCBA using a PCB less than 20 mils thick. We have two facilities running this product. One is using Nitrogen during reflow one is not. What is the advantage and disadvantages of using Nitrogen during the reflow
Electronics Forum | Thu Aug 24 08:59:38 EDT 2000 | Eugene Smelik
Dr. Lee, For Pb-free solders, will the reflow profile be similar to that of Sn/Pb, with an flux activation plateau before going to peak reflow, or will the profile be more linear in nature? Are there advantages/disadvantages to either profile for P
Used SMT Equipment | Soldering - Reflow
Vitronics Soltec XPM2-730 IBE SMT Inventory ID : 130818-002 Vitronics Soltec Serial Number : X2N70017 Vintage : AUG 2005 Details Edge Rail & Mesh Belt Conveyor Auto Chain Oilers Nitrogen & Polar Cooler 480 VAC 3-Phase 70A
Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Industry News | 2018-10-18 08:02:28.0
What are the advantages of use nitrogen process for SMT reflow oven?
Technical Library | 2014-03-20 12:37:39.0
In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use).
Technical Library | 2014-08-19 15:39:13.0
Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come.
The LPKF ZelFlex Z4P is a pneumatic 4-sided high-speed clamping frame for stencils. More information: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/quick-release-frames/zelflex-z4p.htm?utm_source=youtube&utm_medium=social&utm_term=s
SMTnet Express, March 20, 2014, Subscribers: 22559, Members: Companies: 13833, Users: 35907 Today's Vapor Phase Soldering. An Optimized Reflow Technology for Lead Free Soldering. Dipl.-Ing. Helmut Leicht; Andreas Thumm; IBL-Löttechnik Gmb
| https://www.eptac.com/wp-content/uploads/2013/09/eptac_09_18_13.pdf
