New Equipment | Fabrication Services
Base Material: FR4 Layer count: 4 layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: nickel gold plating Soldermask Colors: Green Size:159.25*182/1up
New Equipment | Test Equipment
Smart Tweezers, from Canadian, Siborg Systems Inc., are the inventive combination of a powerful LCR-meter and a set of tweezers integrated into a pocket-sized device. Designed specifically for working with electronics using Surface Mount Technology,
Electronics Forum | Sat Apr 23 19:31:25 EDT 2005 | molosse21
Hi, Is there a solder paste alloy espacially done to solder components on a pcb gold plated ??? I am using the AIM 297DX SN63/PB37 no clean and i had a comments from my customer telling me that i am not using the right alloy. Personally i never he
Electronics Forum | Mon Apr 25 21:52:58 EDT 2005 | KEN
I wonder if yor customer means wrong "flux"? Your not solderng to gold. Your soldering to Nickle. The gold is disolved and dispersed. Your joint strength comes from the SnNi intermetalic.
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Industry News | 2016-09-14 17:44:33.0
IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.
Technical Library | 2013-01-18 02:42:14.0
ENIG (Electroless Nickel/Immersion Gold) is to deposit nickel gold plating which has good solderability, wear resistance , leveling appearance and small electric resistance. It included 4 steps that are pretreatment, immersion nickel, immersion gold and Post treatment...
Technical Library | 2018-07-11 22:46:13.0
For a demanding automotive electronics assembly, a highly thermal fatigue resistant solder alloy is required, which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder alloy is considered as a high reliability solder alloy due to significant improvement in thermal fatigue resistance as compared to a standard Sn-Ag-Cu alloy. The alloy has not only good thermal fatigue properties but it also has superior ductility and tensile strength by appropriate addition of In; however, initial results indicated a sub-par performance in joint reliability when it is soldered on a printed circuit board (PCB) with Electroless Nickel Immersion Gold (ENIG) surface finish. Numerous experiments were performed to find out appropriate alloying element which would help improve the performance on ENIG PCBs. Sn-Ag-Bi-In solder alloys with and without Cu additions were prepared and then tests were carried out to see the performance in a thermal fatigue test and a drop resistance test.to investigate the impact of Cu addition towards the improvement of joint reliability on ENIG finish PCB. Also, the mechanism of such improvement is documented.
SMTnet Express, September 7, 2017, Subscribers: 30,782, Members: Companies: 10,712, Users: 23,761 Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift Young K. Song and Vanja Bukva; Teledyne DALSA As a surface finish for PCBs
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Continued From Previous Page PRINTED CIRCUIT BOARD FABRICATION BASICS AN OUTLINE Earl Moon Proof Of Design (POD) 8. PLATING (AND
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. More to the point there have been changes regarding gold plating and its removal with the introduction of the new J-STD-001 “Requirements for Soldered Electrical and Electronic Assemblies” Revision F
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Korean Black Ginseng Extract, Royal Gold (240g bottle) – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc
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