New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
New Equipment | ESD Control Supplies
High performance fluxophobic stencil treatments wipes Enhance your stencil performance in seconds! Aculon is pleased to announce the launch of their latest generation of stencil coating technology. Aculon’s proprietary technology treats the undersi
Electronics Forum | Mon Aug 29 16:21:20 EDT 2011 | rjlasko
Greetings...I have a customer that has an assembly that is conformal coated with Humiseal 1A33. This assembly has some components (resistors and FET's) that heated up during operation and has discolored the conformal coating around their location.
Electronics Forum | Mon Jul 03 23:11:04 EDT 2000 | Patrick Ng
hi, We are receiving PCBs with gold fingers "discolored". The "discolored" gold fingers can be removed if rub with soft eraser! We are working with suppliers to determine the root cause and eliminate this issue. Pls assist if you have encountered si
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2018-10-18 08:55:30.0
Nitrogen Protection Reflow Oven
Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
The LIRM is a dual workstation inline laser singulation machine specially designed to handle FR4 / FR2 and flex PCBA's up to 1.6mm in thickness. It comes in 2 versions which handles different panel sizes. The system employs a green laser source
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